A Solder Alloy Filled Z-Axis Conductive Adhesive

P. Savolainen, J. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    Original languageEnglish
    Pages (from-to)187-196
    JournalJournal of Adhesion
    Volume49
    Issue number3-4
    Publication statusPublished - 1995
    MoE publication typeA1 Journal article-refereed

    Keywords

    • conductive adhesive
    • microelectronics

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