@inproceedings{375fcbd898194a60b981f51e59a790e7,
title = "A Novel Solder Filled Uniaxially Conductive Adhesive for Solder Replacement",
keywords = "anisotripic adhesive, solder replacement, anisotripic adhesive, solder replacement, anisotripic adhesive, solder replacement",
author = "Savolainen, {Petri J.} and Kivilahti, {Jorma K.}",
year = "1994",
language = "English",
pages = "69--71",
booktitle = "EUPAC 94 1st European Conference on Electronic Packiging Technology & 7th International Conference on Interconnection Technology in Electronics, Essen, 1-3.2.1994",
publisher = "Deutscher Verlag f{\"u}r Schweisstechnik",
address = "Germany",
}