A novel impact test system for more efficient reliability testing

Jussi Hokka, Toni Tuomas Mattila, Jarmo Teeri, Jorma Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    19 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)1125-1133
    JournalMicroelectronics Reliability
    Volume50
    Issue number8
    DOIs
    Publication statusPublished - 2010
    MoE publication typeA1 Journal article-refereed

    Keywords

    • reliability testing, shock impact, failure mechanism,
    • solder interconnection, finite element method

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