@inproceedings{326ccf9001454249a1d3ed4e8e77e483,
title = "A New Under Bump Metallurgy for Solder Bump Flip Chip Applications",
keywords = "flip chip, under bump metallurgy, flip chip, under bump metallurgy, flip chip, under bump metallurgy",
author = "K. Kuloj{\"a}rvi and J. Kivilahti",
year = "1997",
language = "English",
pages = "197--202",
editor = "Davide Roggia",
booktitle = "11th European Microelectronics Conference, Venice Italy, 14.-16.5.1997",
publisher = "International Society for Hybrid Microelectronics (ISHM)",
address = "United States",
}