A New Under Bump Metallurgy for Solder Bump Flip Chip Applications

K. Kulojärvi, J.K. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    4 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)16
    JournalMicroelectronics International
    Volume15
    Issue number2
    Publication statusPublished - 1998
    MoE publication typeA1 Journal article-refereed

    Keywords

    • Flip Chip
    • Reliability
    • Under Bump Metallurgy

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