A New Reliability Aspect of High DensityInterconnections

J. Kivilahti, K. Kulojärvi

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	TMS Annual Meeting, Orlando, 9.-13..2.1997, Orlando, USA
Pages	377-384
Publication status	Published - 1997
MoE publication type	A4 Conference publication

Keywords

@inproceedings{05caf69749b3417e8a3140264d795c16,

title = "A New Reliability Aspect of High DensityInterconnections",

keywords = "high density, reliability, solder, high density, reliability, solder, high density, reliability, solder",

author = "J. Kivilahti and K. Kuloj{\"a}rvi",

year = "1997",

language = "English",

pages = "377--384",

booktitle = "TMS Annual Meeting, Orlando, 9.-13..2.1997, Orlando, USA",

}

TY - GEN

T1 - A New Reliability Aspect of High DensityInterconnections

AU - Kivilahti, J.

AU - Kulojärvi, K.

PY - 1997

Y1 - 1997

KW - high density

KW - reliability

KW - solder

KW - high density

KW - reliability

KW - solder

KW - high density

KW - reliability

KW - solder

M3 - Conference article in proceedings

SP - 377

EP - 384

BT - TMS Annual Meeting, Orlando, 9.-13..2.1997, Orlando, USA

ER -