A New Reliability Aspect of High DensityInterconnections

J. Kivilahti, K. Kulojärvi

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationTMS Annual Meeting, Orlando, 9.-13..2.1997, Orlando, USA
Pages377-384
Publication statusPublished - 1997
MoE publication typeA4 Article in a conference publication

Keywords

  • high density
  • reliability
  • solder

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