A method for microvia-fill process modeling in a Cu plating system with additives

Research output: Contribution to journalArticleScientificpeer-review

Researchers

  • Antti Pohjoranta
  • Robert Tenno

Research units

Details

Original languageEnglish
Pages (from-to)pp. D502-D509
JournalJournal of the Electrochemical Society
Volume154
Issue number10
Publication statusPublished - 2007
MoE publication typeA1 Journal article-refereed

ID: 3562215