A method for microvia-fill process modeling in a Cu plating system with additives

Antti Pohjoranta, Robert Tenno

    Research output: Contribution to journalArticleScientificpeer-review

    60 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)pp. D502-D509
    JournalJournal of the Electrochemical Society
    Volume154
    Issue number10
    Publication statusPublished - 2007
    MoE publication typeA1 Journal article-refereed

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