A Low Temperature Interconnection Method for Electronics Assembly

K. Kulojärvi, J. Kivilahti

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publicationPolymeric Electronics Packaging Conference, 26.-30.10.1997, Norrköping
EditorsRolf Jansson Johan Liu
Place of PublicationNorrköping
PublisherIEEE
Pages70-75
Publication statusPublished - 1997
MoE publication typeA4 Article in a conference publication

Keywords

  • flexible circuits
  • flip chip
  • transfusion technology

Cite this