A Fluxless Low Temperature Method for Electronics

K. Kulojärvi, J.K. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    Original languageEnglish
    Pages (from-to)288
    JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
    Volume21
    Issue number2
    Publication statusPublished - 1998
    MoE publication typeA1 Journal article-refereed

    Keywords

    • Fluxless Soldering
    • Reliability
    • Trancient Liquid Phase Bonding

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