Abstract
The paper examines the accrual of technical debt, which represents an increasingly pressing concern for many organizations. To advance understanding of how this debt-accumulation process unfolds, an in-depth case study was conducted with a large manufacturing firm for identifying particular types of technical debt and potential interdependencies among them. The findings point to architecture debt being "the root of all evil" at the case company, setting in motion dynamics that led to the development of other types of technical debt. Scholarship should benefit from this nuanced articulation and illustration of interdependencies across the various types of technical debt.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 56th Annual Hawaii International Conference on System Sciences |
| Editors | Tung X. Bui |
| Publisher | Hawaii International Conference on System Sciences |
| Pages | 5949-5958 |
| Number of pages | 10 |
| ISBN (Electronic) | 978-0-9981331-6-4 |
| Publication status | Published - 2023 |
| MoE publication type | A4 Conference publication |
| Event | Annual Hawaii International Conference on System Sciences - Maui, United States Duration: 3 Jan 2023 → 6 Jan 2023 Conference number: 56 |
Publication series
| Name | Proceedings of the Annual Hawaii International Conference on System Sciences |
|---|---|
| Volume | 2023-January |
| ISSN (Print) | 1530-1605 |
Conference
| Conference | Annual Hawaii International Conference on System Sciences |
|---|---|
| Abbreviated title | HICSS |
| Country/Territory | United States |
| City | Maui |
| Period | 03/01/2023 → 06/01/2023 |
Keywords
- architectural debt
- case study
- legacy systems
- manufacturing
- technical debt