A Comparative Study of Uniaxially Conductive Solder Particle Filled Adhesive

J. Kivilahti, P. Savolainen, T. Nykänen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationISHM Nordic Annual Meeting, Gothenburg 1993
    Place of PublicationGothenburg
    PublisherISHM Nordic
    Pages71-78
    Publication statusPublished - 1993
    MoE publication typeA4 Article in a conference publication

    Keywords

    • conductive adhesive

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