A Comparative Study of Uniaxially Conductive Solder Particle Filled Adhesive

J. Kivilahti, P. Savolainen, T. Nykänen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	ISHM Nordic Annual Meeting, Gothenburg 1993
Place of Publication	Gothenburg
Publisher	ISHM Nordic
Pages	71-78
Publication status	Published - 1993
MoE publication type	A4 Article in a conference publication

Keywords

@inproceedings{03a0a4c7230e4e0284564302a937879b,

title = "A Comparative Study of Uniaxially Conductive Solder Particle Filled Adhesive",

keywords = "conductive adhesive, conductive adhesive, conductive adhesive",

author = "J. Kivilahti and P. Savolainen and T. Nyk{\"a}nen",

year = "1993",

language = "English",

pages = "71--78",

booktitle = "ISHM Nordic Annual Meeting, Gothenburg 1993",

publisher = "ISHM Nordic",

}

TY - GEN

T1 - A Comparative Study of Uniaxially Conductive Solder Particle Filled Adhesive

AU - Kivilahti, J.

AU - Savolainen, P.

AU - Nykänen, T.

PY - 1993

Y1 - 1993

KW - conductive adhesive

M3 - Conference contribution

SP - 71

EP - 78

BT - ISHM Nordic Annual Meeting, Gothenburg 1993

PB - ISHM Nordic

CY - Gothenburg

ER -