With the rise of artificial intelligence and wearable devices, electronic products are developing rapidly in the direction of miniaturization and high integration. To ensure the reliable use of these electronic products, the heat generated by their high power consumption must be dissipated to avoid the failure of electronic devices. In this project, we collaborate with a Chinese group to propose a dual-mode control over the hierarchical assembly of nanoplates in polymers, allowing for advanced manufacturing of thermally conductive composite materials that promise the minimum use of nanoplates whilst efficient heat dissipation. We anticipate that the results would suggest a promising onset to prolong the lifetime of electronic devices, contributing actively to a sustainable society. The project will be a collaborative paradigm across different international research communities.
|Short title||Peng Bo Mobility China 2022|
|Effective start/end date||01/03/2023 → 28/02/2025|
- Aalto University (lead)
- Suomen Akatemia (Project partner)
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