Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe

Paulasto-Kröckel, Mervi (Principal investigator)
Emadi, Fahimeh (Project Member)
Nieminen, Tarmo (Project Member)
Ross, Glenn (Project Member)
Tiwary, Nikhilendu (Project Member)
Golim, Obert (Project Member)
Vuorinen, Vesa (Project Member)

3 Article
1 Conference article in proceedings

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2024
Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
Golim, O., Vuorinen, V., Wernicke, T., Pawlak, M. & Paulasto-Kröckel, M., 1 Mar 2024, In: Microelectronic Engineering. 286, 112140.
Research output: Contribution to journal › Article › Scientific › peer-review

Open Access
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1 Citation (Scopus)

39 Downloads (Pure)
2022
Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding
Vuorinen, V., Ross, G., Klami, A., Dong, H., Paulasto-Kröckel, M., Wernicke, T. & Pönninger, A., 1 Mar 2022, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12, 3, p. 446 - 453 8 p.
Research output: Contribution to journal › Article › Scientific › peer-review

Open Access
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6 Citations (Scopus)

51 Downloads (Pure)
2021
Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures
Vuorinen, V., Dong, H., Ross, G., Hotchkiss, J., Kaaos, J. & Paulasto-Kröckel, M., Mar 2021, In: Journal of Electronic Materials. 50, 3, p. 818-824 7 p.
Research output: Contribution to journal › Article › Scientific › peer-review

Open Access
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14 Citations (Scopus)

153 Downloads (Pure)