Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe

Paulasto-Kröckel, Mervi (Principal investigator)
Emadi, Fahimeh (Project Member)
Nieminen, Tarmo (Project Member)
Ross, Glenn (Project Member)
Tiwary, Nikhilendu (Project Member)
Golim, Obert (Project Member)
Vuorinen, Vesa (Project Member)

3 Article
1 Conference article in proceedings

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2020
Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding
Hotchkiss, J., Vuorinen, V., Dong, H., Ross, G., Kaaos, J., Paulasto-Krockel, M., Wernicke, T. & Ponninger, A., 15 Sept 2020, Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020. IEEE, 5 p. 9229696
Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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4 Citations (Scopus)

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