Research output per year
Research output per year
Search results
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2024
Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
Golim, O., Vuorinen, V., Wernicke, T., Pawlak, M. & Paulasto-Kröckel, M., 1 Mar 2024, In: Microelectronic Engineering. 286, 112140.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile1 Citation (Scopus)38 Downloads (Pure) -
2022
Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding
Vuorinen, V., Ross, G., Klami, A., Dong, H., Paulasto-Kröckel, M., Wernicke, T. & Pönninger, A., 1 Mar 2022, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12, 3, p. 446 - 453 8 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile6 Citations (Scopus)47 Downloads (Pure) -
2021
Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures
Vuorinen, V., Dong, H., Ross, G., Hotchkiss, J., Kaaos, J. & Paulasto-Kröckel, M., Mar 2021, In: Journal of Electronic Materials. 50, 3, p. 818-824 7 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile13 Citations (Scopus)151 Downloads (Pure) -
2020
Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding
Hotchkiss, J., Vuorinen, V., Dong, H., Ross, G., Kaaos, J., Paulasto-Krockel, M., Wernicke, T. & Ponninger, A., 15 Sept 2020, Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020. IEEE, 5 p. 9229696Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
Open AccessFile4 Citations (Scopus)265 Downloads (Pure)