Top 3 Student Session Winners

Prize: Award or honor granted for a specific work

Description

Impurities in electroplated Cu and void formation in Cu-Sn micro-connects
Awarded date2017

Awarded at event

Event titleEuropean Symposium on Reliability of Electron Devices, Failure Physics and Analysis
LocationHalle, Germany
Period19 Sep 2016 → 22 Sep 2016

    Fingerprint