Vesa Vuorinen
  • Phone+358 50 5922899
  • Tietotie 3

19972021

Research activity per year

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  • 2017

    Thermodynamic-Kinetic method on Microstructural Evolutions in Electronics

    Laurila, T., Aloke, P., Dong, H. & Vuorinen, V., 2017, Handbook of Solid State Diffusion: Diffusion Analysis in Material Applications. Aloke, P. & Divinski, S. (eds.). Elsevier, Vol. 2. p. 101-148

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

    1 Citation (Scopus)
  • 2015

    MEMS Reliability

    Li, J., Mattila, T. & Vuorinen, V., 1 Jan 2015, Handbook of Silicon Based MEMS Materials and Technologies: Second Edition. Elsevier Inc., p. 744-763 20 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

    4 Citations (Scopus)
  • Metallic Alloy Seal Bonding

    Reinert, W., Kulkarni, A., Vuorinen, V. & Merz, P., 1 Jan 2015, Handbook of Silicon Based MEMS Materials and Technologies: Second Edition. Elsevier Inc., p. 626-639 14 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

    3 Citations (Scopus)
  • 2011

    Reliability of Electronic Assemblies Under Mechanical Shock Loading

    Mattila, T. T., Laurila, T. T., Vuorinen, V. & Kivilahti, J. K., 2011, The ELFNET Book on Failure Mechanisms, Testing Methods and Quality Issues of Lead-Free Solder Interconnects. Grossmann, G. & Zanardi, C. (eds.). London, UK, p. 197-225

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

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