Research output per year
Research output per year
Personal profile
Education/Academic qualification
Doctoral degree, Engineering and Technology, Helsinki University of Technology
Award Date: 18 Dec 2006
Master's degree, Engineering and Technology, Helsinki University of Technology
Award Date: 24 Oct 1995
Fingerprint
Dive into the research topics where Vesa Vuorinen is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
-
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Golim, O., Vuorinen, V., Ross, G., Wernicke, T., Pawlak, M., Tiwary, N. & Paulasto-Kröckel, M., 1 Jan 2023, In: Scripta Materialia. 222, 3 p., 114998.Research output: Contribution to journal › Letter › Scientific › peer-review
Open AccessFile4 Citations (Scopus)71 Downloads (Pure) -
Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
Emadi, F., Vuorinen, V., Ross, G. & Paulasto-Kröckel, M., 10 Aug 2023, In: Materials Science and Engineering: A. 881, 8 p., 145398.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile4 Downloads (Pure) -
Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
Tiwary, N., Ross, G., Vuorinen, V. & Paulasto-Kröckel, M., 1 Jan 2023, In: IEEE Transactions on Electron Devices. 70, 1, p. 222-229 8 p., 9969996.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile3 Citations (Scopus)21 Downloads (Pure) -
Aluminium corrosion in power semiconductor devices
Leppänen, J., Ingman, J., Peters, J. H., Hanf, M., Ross, R., Koopmans, G., Jormanainen, J., Forsström, A., Ross, G., Kaminski, N. & Vuorinen, V., Oct 2022, In: Microelectronics Reliability. 137, 9 p., 114766.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile1 Citation (Scopus)157 Downloads (Pure) -
Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding
Vuorinen, V., Ross, G., Klami, A., Dong, H., Paulasto-Kröckel, M., Wernicke, T. & Pönninger, A., 1 Mar 2022, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12, 3, p. 446 - 453 8 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile4 Citations (Scopus)11 Downloads (Pure)
-
PowerizeD: KDT21-PowerizeD - Digitalization by Intelligence for Power Electronic within Value Chains
Paulasto-Kröckel, M., Tiwary, N., Vuorinen, V. & Liu, S.
01/01/2023 → 31/12/2025
Project: Business Finland: Other research funding
-
Power2Power: The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade
Paulasto-Kröckel, M., Gabrelian, G., Liu, S., Tiwary, N., Vuorinen, V. & Nieminen, T.
01/06/2019 → 30/09/2022
Project: Business Finland: Other research funding
-
APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe
Paulasto-Kröckel, M., Emadi, F., Nieminen, T., Ross, G., Tiwary, N., Golim, O. & Vuorinen, V.
01/05/2019 → 31/10/2022
Project: Business Finland: Other research funding
-
POSITION-II: A pilot line for the next generation of smart catheters and implants
Paulasto-Kröckel, M., Österlund, E., Bespalova, K., Dong, H., Vuorinen, V. & Kaaos, J.
01/06/2018 → 31/05/2021
Project: Business Finland: Other research funding
-
ESR Tyyli: Tyyli - Työelämäjaksoja ja työssäoppimista yliopisto-opintoihin
Lemos de Almeida Pinho, P., Millar, R., Vuorinen, V., Kyyrä, J. & Kyyrä, J.
01/04/2015 → 31/03/2018
Project: EU Structural funds (ERDF and ESF)
-
Low Temperature Wafer-Level Cu-In-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Glenn Ross (Invited speaker), Vesa Vuorinen (Contributor) & Mervi Paulasto-Kröckel (Contributor)
4 Oct 2020 → 9 Oct 2020Activity: Talk or presentation types › Conference presentation
-
Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications
Glenn Ross (Speaker), Vesa Vuorinen (Contributor), Joseph Hotchkiss (Contributor), Jani Kaaos (Contributor) & Mervi Paulasto-Kröckel (Contributor)
3 Dec 2019Activity: Talk or presentation types › Conference presentation
-
High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy
Sebastian Brand (Speaker), Michael Kögel (Contributor), Glenn Ross (Contributor), Vesa Vuorinen (Contributor), Mervi Paulasto-Kröckel (Contributor) & Matthias Petzold (Contributor)
27 Nov 2017 → 29 Nov 2017Activity: Talk or presentation types › Conference presentation
-
Foreign Organisation
Vesa Vuorinen (Visiting researcher)
26 May 2016 → 28 May 2016Activity: Visiting an external institution types › Visiting an external academic institution
Press/Media
-
Studies from Aalto University in the Area of Technology Described (Impact of Inherent Design Limitations for Cu-sn Slid Microbumps On Its Electromigration Reliability for 3d Ics)
Mervi Paulasto-Kröckel, Glenn Ross & Vesa Vuorinen
20/01/2023
1 item of Media coverage
Press/Media: Media appearance