Research output per year
Research output per year
Personal profile
Education/Academic qualification
Doctoral degree, Engineering and Technology, Helsinki University of Technology
Award Date: 18 Dec 2006
Master's degree, Engineering and Technology, Helsinki University of Technology
Award Date: 24 Oct 1995
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Dive into the research topics where Vesa Vuorinen is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding
Golim, O., Vuorinen, V. & Paulasto-Krockel, M., 2025, (E-pub ahead of print) In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 4 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open Access -
Low-temperature SLID-TSV Interconnects for 3D (MEMS) Packaging
Emadi, F., Liu, S., Vuorinen, V. & Paulasto-Krockel, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 2, p. 377-386 10 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile6 Downloads (Pure) -
Bonding of ceramics to silver-coated titanium—A combined theoretical and experimental study
Vuorinen, V., Kouhia, R., Könönen, M. & Kivilahti, J. K., May 2024, In: Journal of Biomedical Materials Research - Part B Applied Biomaterials. 112, 5, e35407.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile30 Downloads (Pure) -
Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration
Tiwary, N., Grosse, C., Kögel, M., Windemuth, T., Ross, G., Vuorinen, V., Brand, S. & Paulasto-Kröckel, M., 2024, 2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings. IEEE, 7 p. ( Electronics System-Integration Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
Open AccessFile80 Downloads (Pure) -
Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test
Liu, S., Vuorinen, V., Liu, X., Fredrikson, O., Brand, S., Tiwary, N., Lutz, J. & Paulasto-Krockel, M., 2024, In: IEEE Transactions on Power Electronics. 39, 12, p. 16695-16707 13 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile4 Citations (Scopus)50 Downloads (Pure)
Projects
- 1 Finished
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ESR Tyyli: Tyyli - Työelämäjaksoja ja työssäoppimista yliopisto-opintoihin
Pinho, P. (Project Member), Millar, R. (Project Member), Vuorinen, V. (Project Member), Kyyrä, J. (Principal investigator) & Kyyrä, J. (Project Manager)
01/04/2015 → 31/03/2018
Project: EU Structural funds (ERDF and ESF)
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Low Temperature Wafer-Level Cu-In-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Ross, G. (Invited speaker), Vuorinen, V. (Contributor) & Paulasto-Kröckel, M. (Contributor)
4 Oct 2020 → 9 Oct 2020Activity: Talk or presentation types › Conference presentation
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Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications
Ross, G. (Speaker), Vuorinen, V. (Contributor), Hotchkiss, J. (Contributor), Kaaos, J. (Contributor) & Paulasto-Kröckel, M. (Contributor)
3 Dec 2019Activity: Talk or presentation types › Conference presentation
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High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy
Brand, S. (Speaker), Kögel, M. (Contributor), Ross, G. (Contributor), Vuorinen, V. (Contributor), Paulasto-Kröckel, M. (Contributor) & Petzold, M. (Contributor)
27 Nov 2017 → 29 Nov 2017Activity: Talk or presentation types › Conference presentation
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Foreign Organisation
Vuorinen, V. (Visiting researcher)
26 May 2016 → 28 May 2016Activity: Visiting an external institution types › Visiting an external academic institution
Press/Media
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Studies from Aalto University in the Area of Technology Described (Impact of Inherent Design Limitations for Cu-sn Slid Microbumps On Its Electromigration Reliability for 3d Ics)
Paulasto-Kröckel, M., Ross, G. & Vuorinen, V.
20/01/2023
1 item of Media coverage
Press/Media: Media appearance