Research output per year
Research output per year
Personal profile
Education/Academic qualification
Doctoral degree, Engineering and Technology, Helsinki University of Technology
Award Date: 18 Dec 2006
Master's degree, Engineering and Technology, Helsinki University of Technology
Award Date: 24 Oct 1995
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Dive into the research topics where Vesa Vuorinen is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Finite element simulation of solid-liquid interdiffusion bonding process: Understanding process dependent thermomechanical stress
Tiwary, N., Vuorinen, V., Ross, G. & Paulasto-Krockel, M., 1 May 2022, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12, 5, p. 847-856 10 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile3 Downloads (Pure) -
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
Emadi, F., Vuorinen, V., Dong, H., Ross, G. & Paulasto-Kröckel, M., 15 Jan 2022, In: Journal of Alloys and Compounds. 890, 10 p., 161852.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile17 Downloads (Pure) -
A humidity-induced novel failure mechanism in power semiconductor diodes
Leppänen, J., Ross, G., Vuorinen, V., Ingman, J., Jormanainen, J. & Paulasto-Kröckel, M., Aug 2021, In: Microelectronics Reliability. 123, 7 p., 114207.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile153 Downloads (Pure) -
Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding
Vuorinen, V., Ross, G., Klami, A., Dong, H., Paulasto-Kröckel, M., Wernicke, T. & Pönninger, A., 9 Sep 2021, (E-pub ahead of print) In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open Access -
Joint International Master in Smart Systems Integrated Solutions
Aasmundtveit, K. E., Wang, C., Rencz, M., Paulasto-Kröckel, M., Imenes, K., Desmulliez, M., Ender, F. & Vuorinen, V., 27 Apr 2021, Proceedings of Smart Systems Integration Conference, SSI 2021. IEEE, 4 p. 9466979Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review
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Power2Power: The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade
Paulasto-Kröckel, M., Klami, A., Nieminen, T., Vuorinen, V., Tiwary, N. & Gabrelian, G.
01/06/2019 → 30/09/2022
Project: Business Finland: Other research funding
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APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe
Paulasto-Kröckel, M., Golim, O., Klami, A., Emadi, F., Tiwary, N., Vuorinen, V., Ross, G. & Nieminen, T.
01/05/2019 → 31/10/2022
Project: Business Finland: Other research funding
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POSITION-II: A pilot line for the next generation of smart catheters and implants
Paulasto-Kröckel, M., Bespalova, K., Dong, H., Österlund, E., Kaaos, J. & Vuorinen, V.
01/06/2018 → 31/05/2021
Project: Business Finland: Other research funding
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ESR Tyyli: Tyyli - Työelämäjaksoja ja työssäoppimista yliopisto-opintoihin
Lemos de Almeida Pinho, P., Millar, R., Vuorinen, V., Kyyrä, J. & Kyyrä, J.
01/04/2015 → 31/03/2018
Project: EU Structural funds (ERDF and ESF)
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AthLEDics: Advanced technolgies for energy efficient LED Lighting applications to satisfy user needs
Vuorinen, V., Lemos de Almeida Pinho, P., Tetri, E., Paakkinen, M., Lehtovaara, J. & Baniya, R.
01/06/2010 → 31/12/2013
Project: Business Finland: Other research funding
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Low Temperature Wafer-Level Cu-In-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Glenn Ross (Invited speaker), Vesa Vuorinen (Contributor) & Mervi Paulasto-Kröckel (Contributor)
4 Oct 2020 → 9 Oct 2020Activity: Talk or presentation types › Conference presentation
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Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications
Glenn Ross (Speaker), Vesa Vuorinen (Contributor), Joseph Hotchkiss (Contributor), Jani Kaaos (Contributor) & Mervi Paulasto-Kröckel (Contributor)
3 Dec 2019Activity: Talk or presentation types › Conference presentation
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High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy
Sebastian Brand (Speaker), Michael Kögel (Contributor), Glenn Ross (Contributor), Vesa Vuorinen (Contributor), Mervi Paulasto-Kröckel (Contributor) & Matthias Petzold (Contributor)
27 Nov 2017 → 29 Nov 2017Activity: Talk or presentation types › Conference presentation
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Foreign Organisation
Vesa Vuorinen (Visiting researcher)
26 May 2016 → 28 May 2016Activity: Visiting an external institution types › Visit abroad