Photo of Tomi Laurila
  • Phone+358503414375
  • Otakaari 7 B

19992020

Research output per year

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Research Output

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Chapter
2017

Defects, Driving Forces and Definitions of Diffusion Coefficients in Solids

Paul, A., Laurila, T. & Divinski, S., 10 Apr 2017, Handbook of Solid State Diffusion: Diffusion Fundamentals and Techniques . Paul, A. & Divinski, S. (eds.). ACADEMIC PRESS, Vol. 1. p. 1-54 54 p.

Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

3 Citations (Scopus)

Thermodynamic-Kinetic method on Microstructural Evolutions in Electronics

Laurila, T., Aloke, P., Dong, H. & Vuorinen, V., 2017, Handbook of Solid State Diffusion: Diffusion Analysis in Material Applications. Aloke, P. & Divinski, S. (eds.). Elsevier, Vol. 2. p. 101-148

Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

1 Citation (Scopus)

Types of Defects, Driving Forces and Diffusion in Solids

Paul, A., Laurila, T. & Divinsky, S., 2017, Handbook of Solid State Diffusion: Diffusion Fundamentals and Techniques, Vol. 1. Aloke, P. & Divinski, S. (eds.). Elsevier, Vol. 1. p. 1-54

Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

2013

Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling

Li, J., Laurila, T., Mattila, T. T., Xu, H. & Paulasto-Kröckel, M., 2013, The Study of Recrystallization. W.Wilson, P. (ed.). Croatia: InTech, p. 91-116

Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

2011

Reliability of Electronic Assemblies Under Mechanical Shock Loading

Mattila, T. T., Laurila, T. T., Vuorinen, V. & Kivilahti, J. K., 2011, The ELFNET Book on Failure Mechanisms, Testing Methods and Quality Issues of Lead-Free Solder Interconnects. Grossmann, G. & Zanardi, C. (eds.). London, UK, p. 197-225

Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

2007

Effect factors behind the reliability of high density lead-free interconnections

Mattila, T., Laurila, T. & Kivilahti, J., 2007, Micro-and Opto Electronic Materials and Structures: Physics,Mechanics;Design, Packaging. Suhir, E. & Wong, C. P. (eds.). New York, p. 313-350

Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

Metallurgical factors behind the reliability of high density lead-free interconnections

Mattila, T., Laurila, T. & Kivilahti, J., 2007, Micro-and Optoelectronic Materials and Structures; Physics, Mechanics, Design, Reliability, Packaging. New York, p. 313-350

Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

Reliability of Electronic Assemblies Under Mechanical Shock Loading

Mattila, T. T., Laurila, T. & Kivilahti, J. K., 2007, The Blue- White Book on Failure Mechanisms and Testing Methods for Lead-Free Solder Interconnects. European Lead-Free Network / ELFNET

Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review