Research output per year
Research output per year
Personal profile
Education/Academic qualification
Doctoral degree, Engineering and Technology, Indian Institute of Technology Bombay
Award Date: 24 Mar 2019
Master's degree, Engineering and Technology, Indian Institute of Technology Bombay
Award Date: 27 Jun 2012
Bachelor's degree, Engineering and Technology, Institute of Technical Education and Research, Bhubaneswar
Award Date: 30 Jul 2010
Keywords
- Advanced packaging & reliability
- 3D heterogeneous integration
- MEMS/NEMS
- III/V piezoelectric devices
- Semiconductor physics
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Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Golim, O., Vuorinen, V., Ross, G., Wernicke, T., Pawlak, M., Tiwary, N. & Paulasto-Kröckel, M., 1 Jan 2023, In: Scripta Materialia. 222, 3 p., 114998.Research output: Contribution to journal › Letter › Scientific › peer-review
Open AccessFile1 Citation (Scopus)39 Downloads (Pure) -
Finite element simulation of solid-liquid interdiffusion bonding process: Understanding process dependent thermomechanical stress
Tiwary, N., Vuorinen, V., Ross, G. & Paulasto-Krockel, M., 1 May 2022, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12, 5, p. 847-856 10 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile2 Citations (Scopus)20 Downloads (Pure) -
Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
Tiwary, N., Ross, G., Vuorinen, V. & Paulasto-Kröckel, M., 5 Dec 2022, (E-pub ahead of print) In: IEEE Transactions on Electron Devices. p. 1-8 8 p., 9969996.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile10 Downloads (Pure) -
Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding
Emadi, F., Liu, S., Klami, A., Tiwary, N., Vuorinen, V. & Paulasto-Krockel, M., 2022, ASDAM 2022 - Proceedings: 14th International Conference on Advanced Semiconductor Devices and Microsystems. Marek, J., Donoval, D. & Vavrinsky, E. (eds.). IEEE, 6 p. (ASDAM 2022 - Proceedings: 14th International Conference on Advanced Semiconductor Devices and Microsystems).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review
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Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds
Papatzacos, P., Tiwary, N., Hoivik, N., Nguyen, H-V., Roy, A. & Aasmundtveit, K. E., 13 Nov 2021, 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, p. 1-5 5 p. 9584990Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review
2 Citations (Scopus)
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iRel40: Intelligent Reliability 4.0
Paulasto-Kröckel, M., Emadi, F., Liu, S., Ross, G. & Tiwary, N.
01/05/2020 → 30/04/2023
Project: Business Finland: Other research funding
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Power2Power: The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade
Paulasto-Kröckel, M., Gabrelian, G., Nieminen, T., Liu, S., Vuorinen, V. & Tiwary, N.
01/06/2019 → 30/09/2022
Project: Business Finland: Other research funding
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APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe
Paulasto-Kröckel, M., Emadi, F., Golim, O., Nieminen, T., Ross, G., Tiwary, N. & Vuorinen, V.
01/05/2019 → 31/10/2022
Project: Business Finland: Other research funding