Mervi Paulasto-Kröckel

Professor (Associate Professor)

Research outputs

  1. 2013
  2. Published

    Mesh-based method for measuring intracranial volume in patients with craniosynostosis

    Ritvanen, A. G., de Oliveira, M. E., Koivikko, M. P., Hallila, H. O., Haaja, J. K., Koljonen, V. S., Leikola, J. P., Hukki, J. J. & Paulasto-Krockel, M. M., 2013, In : INTERNATIONAL JOURNAL OF COMPUTER ASSISTED RADIOLOGY AND SURGERY. 8, 5, p. 703-709

    Research output: Contribution to journalArticleScientificpeer-review

  3. Published

    Reliability assessment of a MEMS microphone under shock impact loading

    Li, J., Makkonen, J., Broas, M., Hokka, J., Mattila, T. T., Paulasto-Kröckel, M., Meng, J. & Dasgupta, A., 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013, Wroclaw, Poland, April 15-17, 2013. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). NJ, United States: IEEE CPMT, p. 6

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. Published

    Reliability of wafer-level SLID bonds for MEMS encapsulation

    Xu, H., Broas, M., Dong, H., Vuorinen, V., Suni, T., Vähänen, S., Monnoyer, P. & Paulasto-Kröckel, M., 2013, Europe Microelectronics Packaging Conference (EMPC2013). Grenoble, France

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Published

    Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling

    Li, J., Laurila, T., Mattila, T. T., Xu, H. & Paulasto-Kröckel, M., 2013, The Study of Recrystallization. W.Wilson, P. (ed.). Croatia: InTech, p. 91-116

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

  6. Published
  7. Published

    Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections.Part 1: Effects of Test Parameters

    Hokka, J., Mattila, T. T., Xu, H. & Paulasto-Kröckel, M., 2013, In : Journal of Electronic Materials. 42, 6, p. 1171-1183

    Research output: Contribution to journalArticleScientificpeer-review

  8. Published

    Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections-Part 2: Failure Mechanisms

    Hokka, J., Mattila, T. T., Xu, H. & Paulasto-Kröckel, M., 2013, In : Journal of Electronic Materials. 42, 6, p. 963-972

    Research output: Contribution to journalArticleScientificpeer-review

  9. Published

    Thermodynamic modeling of Au-Ce-Sn ternary system

    Dong, H., Tao, X., Laurila, T., Vuorinen, V. & Paulasto-Kröckel, M., 2013, In : Calphad: Computer Coupling of Phase Diagrams and Thermochemistry. 42, 42, p. 38-50

    Research output: Contribution to journalArticleScientificpeer-review

  10. Published

    Thermodynamic reassessment of Au-Ni-Sn ternary system

    Dong, H., Vuorinen, V., Laurila, T. & Paulasto-Kröckel, M., 2013, In : Calphad: Computer Coupling of Phase Diagrams and Thermochemistry. 43, p. 61-70

    Research output: Contribution to journalArticleScientificpeer-review

  11. Published

    Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation

    Suni, T., Xu, H., Vuorinen, V., Heikkinen, H., Vähänen, S., Jaakkola, A., Monnoyer, P. & Paulasto-Kröckel, M., 2013, Europe Microelectronics Packaging Conference, Grenoble, France, 10-12.09.2013. Grenoble, France, (European Microelectronics Packaging Conference).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  12. Published

    Wafer-level SLID bonding for MEMS encapsulation

    Xu, H., Suni, T., Vuorinen, V., Li, J., Heikkinen, H., Monnoyer, P. & Paulasto-Kröckel, M., 2013, In : Advances in Manufacturing. 1, 3, p. 226-235

    Research output: Contribution to journalArticleScientificpeer-review

  13. 2012
  14. Published

    The combined effect of shock impacts and operational power cycles on the reliability of handheld device component board interconnections

    Karppinen, J. S., Laurila, T., Mattila, T. T. & Paulasto-KröCkel, M., Nov 2012, In : Journal of Electronic Materials. 41, 11, p. 3232-3246 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. Published

    Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices

    Vuorinen, V., Dong, H., Xu, H., Vähänen, S., Suni, T., Laurila, T. & Paulasto-Kröckel, M., 2012, ESTC 4th Electronic System-Integration Technology Conference, Sept. 17-20, 2012, Amsterdam. IEEE CPMT

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  16. Published

    A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive

    Li, J., Turunen, M., Niiranen, S., Chen, H. & Paulasto-Kröckel, M., 2012, In : Microelectronics Reliability. 52, Dec., p. 29622969

    Research output: Contribution to journalArticleScientificpeer-review

  17. Published

    Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading

    Laurila, T., Karppinen, J., Vuorinen, V., Li, J. & Paulasto-Kröckel, M., 2012, In : Journal of Electronic Materials. 41, 11, p. 3179-3195

    Research output: Contribution to journalArticleScientificpeer-review

  18. Published

    Finite element modeling for reliability assessment of solder interconnections in a power transistor

    Li, J., Karppinen, J., Laurila, T., Vuorinen, V. & Paulasto -Kröckel, M., 2012, ESTC 4th Electronic System-Integration Technology Conference, Sept. 17-20, 2012, Amsterdam. IEEE CPMT

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  19. Published

    Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test

    Li, J., Tarvainen, T., Rich, J., Turunen, M. & Paulasto-Kröckel, M., 2012, In : Journal of Electronic Materials. 41, 9, p. 2613-2620

    Research output: Contribution to journalArticleScientificpeer-review

  20. Published

    Interfacial Compatibility in Microelectronics: Away From the Trial and Error Approach

    Laurila, T., Vuorinen, V., Turunen, M., Mattila, T. T., Paulasto-Kröckel, M. & Kivilahti, J., 2012, Germany. 217 p.

    Research output: Book/ReportBookScientificpeer-review

  21. Published

    Methods for Reliability Assessment of MEMS Devices - Case Studies of a MEMS Microphone and a 3-Axis MEMS Gyroscope

    Hokka, J., Broas, M., Makkonen, J., Raami, J., Li, J., Mattila, T. T. & Paulasto-Kröckel, M., 2012, ECTC 62nd Electronic Components and Technology Conference, San Diego, CA, May 29- June 1, 2012. IEEE CPMT, p. 62-69

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  22. Published

    Reliability Assessment of MEMS Devices A Case Study of a 3 axis Gyroscope

    Makkonen, J., Broas, M., Li, J., Hokka, J., Mattila, T. T. & Paulasto-Kröckel, M., 2012, ESTC 4th Electronic System-Integration Technology Conference, Amsterdam, The Netherlands, September 17-20, 2012. Hoboken, NJ: IEEE CPMT, p. 62-69

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  23. Published

    Shock impact reliability characterization of a handheld product in accelerated tests and use environment

    Karppinen, J., Li, J., Pakarinen, J., Mattila, T. & Paulasto-Kröckel, M., 2012, In : Microelectronics Reliability. 52, 1, p. 190-198

    Research output: Contribution to journalArticleScientificpeer-review

  24. Published

    “The combined effect of shock impacts and operational power cycles on the reliability of a high-density mobile device component board”

    Karppinen, J. S., Laurila, T., Mattila, T. T. & Paulasto-Kröckel, M., 2012, In : Journal of Electronic Materials. 41, 11, p. 3232-3246

    Research output: Contribution to journalArticleScientificpeer-review

  25. Published

    Thermodynamic assessment of Au-Ho and Au-Tm binary systems

    Dong, H., Tao, X., Laurila, T. & Paulasto-Kröckel, M., 2012, In : Calphad: Computer Coupling of Phase Diagrams and Thermochemistry. 37, 37, p. 87-93

    Research output: Contribution to journalArticleScientificpeer-review

  26. 2011
  27. Published

    Toward comprehensive reliability assessment of electronics by a combined loading approach

    Mattila, T. T. & Paulasto-Kröckel, M., Jun 2011, In : Microelectronics Reliability. 51, 6, p. 1077-1091 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  28. Published

    Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing

    Kemppainen, J., Mattila, T. T. & Paulasto-Kröckel, M., 2011, APM International Symposium on Advanced Packaging Materials (APM), Xiamen, China, 25-28 Oct. 2011. IEEE CPMT, p. 362-372

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  29. Published

    Development of methods for reliability assessment of 3-axial MEMS gyroscopes

    Hokka, J., Hyvönen, H., Li, J., Mattila, T. T. & Paulasto-Kröckel, M., 2011, IMAPS Nordic Annual Conference, Espoo, Finland, June 5-8, 2011. p. 1-6

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  30. Published

    Effect of constant and cyclic current stressing on the evolution of intermetallic compound layers

    Laurila, T., Karppinen, J., Vuorinen, V., Paul, A. & Paulasto-Kröckel, M., 2011, In : Journal of Electronic Materials. 40, 7, p. 1517-1526

    Research output: Contribution to journalArticleScientificpeer-review

  31. Published

    Effects of shock impact repetition frequency on the reliability of component boards

    Hokka, J., Mattila, T. T. & Paulasto-Kröckel, M., 2011, ECTC 61st Electronic Component and Technology Conference, Orlando, FL, May 31- June 3, 2011. IEEE CPMT, p. 447-453

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  32. Published

    Feature-invariant image registration method for quantification of surgical outcomes in patients with craniosynostosis: a preliminary study

    de Oliveira, M. E., Hallila, H., Ritvanen, A., Buechler, P., Paulasto, M. & Hukki, J., 2011, In : JOURNAL OF PEDIATRIC SURGERY. 46, 10, p. pp. E1-E8

    Research output: Contribution to journalArticleScientificpeer-review

  33. Published

    Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests

    Li, J., Xu, H., Hokka, J., Mattila, T. T., Chen, H. & Paulasto-Kröckel, M., 2011, In : Soldering and Surface Mount Technology. 23, 3, p. 161-167

    Research output: Contribution to journalArticleScientificpeer-review

  34. Published

    Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

    Chen, H., Mueller, M., Mattila, T. T., Li, J., Liu, X., Wolter, K-J. & Paulasto-Kröckel, M., 2011, In : Journal of Materials Research. 26, 16, p. 2103-2116

    Research output: Contribution to journalArticleScientificpeer-review

  35. Published

    Thermal Investigation of a Battery Module for Work Machines

    Abdul-Quadir, Y., Heikkilä, P., Lehmuspelto, T., Karppinen, J., Laurila, T. & Paulasto-Kröckel, M., 2011, EuroSimE 2011, Liz, Austria, 18-20th April 2011. Ernst, L. J., Zhang, GQ., Van Driel, W. D., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). IEEE

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  36. Published

    Thermodynamic assessment of Au-La and Au-Er binary systems

    Dong, H., Tao, X. M., Liu, H. S., Laurila, T. & Paulasto-Kröckel, M., 2011, In : Journal of Alloys and Compounds. 509, 13, p. 4439-444

    Research output: Contribution to journalArticleScientificpeer-review

  37. Published

    Toward comprehensive reliability assessment of electronic component boards by a combined loading approach

    Mattila, T. T. & Paulasto-Kröckel, M., 2011, In : Microelectronics Reliability. 51, 6, p. 1077-1091

    Research output: Contribution to journalArticleScientificpeer-review

  38. 2010
  39. Published

    Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

    Laurila, T., Vuorinen, V. & Paulasto-Kröckel, M., 31 Mar 2010, In : MATERIALS SCIENCE AND ENGINEERING R: REPORTS. 68, 1-2, p. 1-38 38 p.

    Research output: Contribution to journalArticleScientificpeer-review

  40. Published

    Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections

    Mattila, T. T., Xu, H., Ratia, O. & Paulasto-Kröckel, M., 2010, 60th Electronic Components and Technology conference, Las Vegas, Nv, June 1-4, June 2010. IEEE CPMT, p. 581-590

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  41. Published

    Failure mechanism of solder interconnections under thermal cycling conditions

    Mattila, T. T., Mueller, M., Paulasto-Kröckel, M. & Wolter, K-J., 2010, ESTC 3rd Electronic System-Integration Technology Conference, Berlin, Germany, September 13-16, 2010. IEEE CPMT, p. 1-8

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  42. Published

    FEM simulation for reliability assessment of component boards drop tests at various temperatures

    Li, J., Mattila, T. T., Xu, H. & Paulasto-Kröckel, M., 2010, In : Simulation Modelling Practice and Theory. 18, p. 1355-1364

    Research output: Contribution to journalArticleScientificpeer-review

  43. Published

    Formation of mechanical strains in the component board of a high-end handheld product during shock impact

    Karppinen, J., Pakarinen, J., Mattila, T. T. & Paulasto-Kröckel, M., 2010, ESTC 3rd Electronic System-Integration Technology Conference (ESTC), Berliini, Saksa, 14-16.9.2010. IEEE CPMT

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  44. Published

    High.speed mechanical impact reliability of solder interconnections in high-power LEDs

    Hokka, J., Caers, J., De Jong, M., Peels, W., Sykes, B., Zhang, K. & Paulasto-Kröckel, M., 2010, EuroSimE Thermo, Mechanical & Multiphysics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), Bourdeaux, France, 2010. IEEE CPMT, p. 1-5

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  45. Published

    Impurity and Alloying Effects on Reaction Layers in Lead-Free Soldering

    Laurila, T., Vuorinen, V. & Paulasto-Kröckel, M., 2010, In : MATERIALS SCIENCE AND ENGINEERING R: REPORTS. R68, p. 1-38

    Research output: Contribution to journalReview ArticleScientificpeer-review

  46. Published

    On the role of electromigration in power cycling tests

    Vuorinen, V., Karppinen, J., Laurila, T., Paul, A. & Paulasto-Kröckel, M., 2010, ESTC 3rd Electronic System-Integration Technology Conference, ESTC 2010; Berlin; 13-20 September 2010. Berliini: IEEE CPMT, p. 1-7

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  47. Published

    Postoperative Evaluation of Surgery for Craniosynostosis Based on Image Registration Techniques

    Elias de Oliveira, M., Hallila, H., Ritvanen, A., Buchler, P., Paulasto-Kröckel, M. & Hukki, J., 2010, EMBC 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society, August 31 - September 4, 2010, Buenos Aires, Argentina. p. 5620-5623 4 p. (IEEE Engineering in Medicine and Biology Society Conference Proceedings).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  48. Published

    Simulation of dynamic recrystallization in solder interconnections during thermal cycling

    Li, J., Xu, H., Mattila, T. T., Kivilahti, J. K., Laurila, T. & Paulasto-Kröckel, M., 2010, In : Computational Materials Science. 50, 2, p. 690-697

    Research output: Contribution to journalArticleScientificpeer-review

  49. Published

    Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment

    Karppinen, J., Mattila, T. T., Li, J. & Paulasto-Kröckel, M., 2010, In : Microelectronics Reliability. 50, 12, p. 1994-2000

    Research output: Contribution to journalArticleScientificpeer-review

  50. Published

    Toward comprehensive reliability testing of electronic component boards

    Mattila, T. T. & Paulasto-Kröckel, M., 2010, 11th Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems (EuroSimE), Bordeaux, France, April 26-28, 2010. IEEE CPMT, p. 15-27

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  51. 2009
  52. Published

    Understanding materials compatibility issues in electronics packaging

    Paulasto-Kröckel, M., Laurila, T. & Vuorinen, V., 2009, Proceedings of the Electronic Packaging Technology Conference, EPTC. p. 494-499 6 p. 5416496

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  53. 2001
  54. Published

    Flip Chip Die Attach Development for Multichip Mechatronics Power Packages

    Paulasto-Kröckel, M. & Hauck, T., 2001, In : IEEE Transactions on Electronics Packaging Manufacturing. 24, 4, p. 300-306 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  55. 2000
  56. Published

    Reliability of flip chip die attach in multichip mechatronic power module

    Paulasto, M., Hauck, T. & Kolbeck, A., 18 Jun 2000, Proceedings of the 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. IEEE, p. 93-100 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  57. 1998
  58. Published

    Metallurgical reactions controlling the brazing of Al2O3 with Ag–Cu–Ti filler alloys

    Paulasto, M. & Kivilahti, J., 1998, In : Journal of Materials Research. 13, 2, p. 343-352

    Research output: Contribution to journalArticleScientificpeer-review

ID: 80301