Activities per year
Activities
Search results
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Low Temperature Wafer-Level Cu-In-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Glenn Ross (Invited speaker), Vesa Vuorinen (Contributor) & Mervi Paulasto-Kröckel (Contributor)
4 Oct 2020 → 9 Oct 2020Activity: Talk or presentation types › Conference presentation
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Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications
Glenn Ross (Speaker), Vesa Vuorinen (Contributor), Joseph Hotchkiss (Contributor), Jani Kaaos (Contributor) & Mervi Paulasto-Kröckel (Contributor)
3 Dec 2019Activity: Talk or presentation types › Conference presentation
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Atomic layer deposition of AlN from AlCl3 using NH3 and Ar/NH3 plasma as co-reactant
Ville Rontu (Speaker), Perttu Sippola (Speaker), Mikael Broas (Speaker), Timo Sajavaara (Speaker), Mervi Paulasto-Kröckel (Speaker), Harri Lipsanen (Speaker) & Sami Franssila (Speaker)
15 Jul 2017 → 18 Jul 2017Activity: Talk or presentation types › Conference presentation
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High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy
Sebastian Brand (Speaker), Michael Kögel (Contributor), Glenn Ross (Contributor), Vesa Vuorinen (Contributor), Mervi Paulasto-Kröckel (Contributor) & Matthias Petzold (Contributor)
27 Nov 2017 → 29 Nov 2017Activity: Talk or presentation types › Conference presentation
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ECSEL JU InforMed Kick-off meeting, Eindhoven, 2.-4.6.2015, Alankomaat
Mervi Paulasto-Kröckel (Contributor)
2015Activity: Talk or presentation types › Conference presentation
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IEEE CPMT Board of Governor, Dallas, 6.-9.11.2015, USA
Mervi Paulasto-Kröckel (Contributor)
2015Activity: Talk or presentation types › Conference presentation
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IEEE CPMT Board of Governor, Dallas, 6.-9.11.2015, USA
Mervi Paulasto-Kröckel (Contributor)
2015Activity: Talk or presentation types › Conference presentation
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IEEE Electronics System-Integration Technology Conference (ESTC2014), Helsinki, 16-18.9.2014, Finland
Mervi Paulasto-Kröckel (Contributor)
2014Activity: Talk or presentation types › Conference presentation
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ADVANCED FAILURE ANALYSIS AND RELIABILITY ASSESSMENT IN 3D AND HETEROGENOUS MICROELECTRONIC INTEGRATION INDUSTRY, Halle, Germany, 9-10.4.2014, Germany
Mervi Paulasto-Kröckel (Contributor)
2014Activity: Talk or presentation types › Conference presentation
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nanoFIS 2014 - Functional Integrated nano Systems, Graz, Austria, December 3-5, 2014, Austria
Mervi Paulasto-Kröckel (Contributor)
2014Activity: Talk or presentation types › Conference presentation
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Keynote talk, at nanoFIS 2014 - Functional Integrated nano Systems
Mervi Paulasto-Kröckel (Keynote speaker)
2014Activity: Talk or presentation types › Conference presentation
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ESREF2014 25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Berlin, Germany, September 29 - October 2, 2014., Germany
Mervi Paulasto-Kröckel (Contributor)
2014Activity: Talk or presentation types › Conference presentation
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15th EPTC, Singapore
Mervi Paulasto-Kröckel (Contributor)
2013Activity: Talk or presentation types › Conference presentation
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52nd IEEE ECTC, USA
Mervi Paulasto-Kröckel (Contributor)
2013Activity: Talk or presentation types › Conference presentation
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EMPC2013, France
Mervi Paulasto-Kröckel (Contributor)
2013Activity: Talk or presentation types › Conference presentation
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IEEE ECTC (Electronic Components and Technology Conference), San Diego, May 28-31, United States
Mervi Paulasto-Kröckel (Contributor)
2012Activity: Talk or presentation types › Conference presentation
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IEEE ESTC (Electronic System Integration Technology Conference), Amsterdam, September, Alankomaat
Mervi Paulasto-Kröckel (Contributor)
2012Activity: Talk or presentation types › Conference presentation
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41st European Solid-State Device Research Conference (ESSDERC), Helsinki, Finland, 12-16.9.2011, Finland
Mervi Paulasto-Kröckel (Contributor)
2011Activity: Talk or presentation types › Conference presentation
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IEEE 13th Electronics Packaging Technology Conference (EPTC 2011), Singapore, 7.-9.12.2011, Singapore
Mervi Paulasto-Kröckel (Contributor)
2011Activity: Talk or presentation types › Conference presentation
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IEEE Advanced Packaging Materials Conference (APM), Xiamen, China, 25-28.10.2011, China
Mervi Paulasto-Kröckel (Contributor)
2011Activity: Talk or presentation types › Conference presentation