Research output per year
Research output per year
Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
Education/Academic qualification
Doctoral degree, Engineering and Technology, Helsinki University of Technology
Award Date: 22 Aug 1995
Master's degree, Engineering and Technology, Helsinki University of Technology
Award Date: 28 Aug 1990
Fingerprint
Dive into the research topics where Mervi Paulasto-Kröckel is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration
Tiwary, N., Grosse, C., Kögel, M., Windemuth, T., Ross, G., Vuorinen, V., Brand, S. & Paulasto-Kröckel, M., 2024, 2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings. IEEE, 7 p. (2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
Open AccessFile30 Downloads (Pure) -
Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test
Liu, S., Vuorinen, V., Liu, X., Fredrikson, O., Brand, S., Tiwary, N., Lutz, J. & Paulasto-Krockel, M., 2024, In: IEEE Transactions on Power Electronics. 39, 12, p. 16695-16707 13 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile1 Citation (Scopus)15 Downloads (Pure) -
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
Golim, O., Vuorinen, V., Ross, G., Suihkonen, S. & Paulasto-Kröckel, M., Mar 2024, In: Materials Characterization. 209, 113772.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile1 Citation (Scopus)78 Downloads (Pure) -
Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
Golim, O., Vuorinen, V., Wernicke, T., Pawlak, M. & Paulasto-Kröckel, M., 1 Mar 2024, In: Microelectronic Engineering. 286, 112140.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile2 Citations (Scopus)62 Downloads (Pure) -
Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication
Bespalova, K., Ross, G., Suihkonen, S. & Paulasto-Kröckel, M., Apr 2024, In: Advanced Electronic Materials. 10, 4, 8 p., 2300628.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile3 Citations (Scopus)65 Downloads (Pure)
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PowerizeD: KDT21-PowerizeD - Digitalization by Intelligence for Power Electronic within Value Chains
Paulasto-Kröckel, M. (Principal investigator), Tiwary, N. (Project Member), Vuorinen, V. (Project Member), Liu, S. (Project Member), Radwan, M. (Project Member) & Matondang, J. S. (Project Member)
01/01/2023 → 31/12/2025
Project: Business Finland: Other research funding
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3DPiezoMems R2B: Aalto-R2B-3DPiezoMems
Paulasto-Kröckel, M. (Principal investigator), Nieminen, T. (Project Member), Bespalova, K. (Project Member), Suihkonen, S. (Project Member), Hallanoro, P. (Project Member), Matondang, J. S. (Project Member), Ali, A. (Project Member), Gabrelian, G. (Project Member) & Ross, G. (Project Member)
01/01/2023 → 31/12/2024
Project: Business Finland: New business from research ideas (TUTLI)
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WIBASE: Wide Band-Gap Semiconductor Power Electronics
Paulasto-Kröckel, M. (Principal investigator)
01/01/2025 → 31/12/2027
Project: Business Finland: Strategic centres for science, technology and innovation (SHOK)
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iRel 40: Intelligent Reliability 4.0
Paulasto-Kröckel, M. (Principal investigator), Emadi, F. (Project Member), Liu, S. (Project Member), Ross, G. (Project Member) & Tiwary, N. (Project Member)
01/05/2020 → 31/10/2023
Project: Business Finland: Other research funding
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Power2Power: The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade
Paulasto-Kröckel, M. (Principal investigator), Gabrelian, G. (Project Member), Liu, S. (Project Member), Tiwary, N. (Project Member), Vuorinen, V. (Project Member) & Nieminen, T. (Project Member)
01/06/2019 → 30/09/2022
Project: Business Finland: Other research funding
Prizes
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Best paper award
Paulasto-Kröckel, M. (Recipient) & Hauck, T. (Recipient), Oct 2000
Prize: Award or honor granted for a specific work
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JVST A Best ALD Paper Award
Österlund, E. (Recipient), Seppänen, H. (Recipient), Bespalova, K. (Recipient), Miikkulainen, K. (Recipient) & Paulasto-Kröckel, M. (Recipient), 28 Jun 2021
Prize: Award or honor granted for a specific work
Activities
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Low Temperature Wafer-Level Cu-In-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Ross, G. (Invited speaker), Vuorinen, V. (Contributor) & Paulasto-Kröckel, M. (Contributor)
4 Oct 2020 → 9 Oct 2020Activity: Talk or presentation types › Conference presentation
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Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications
Ross, G. (Speaker), Vuorinen, V. (Contributor), Hotchkiss, J. (Contributor), Kaaos, J. (Contributor) & Paulasto-Kröckel, M. (Contributor)
3 Dec 2019Activity: Talk or presentation types › Conference presentation
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Keynote talk, at Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum
Paulasto-Kröckel, M. (Keynote speaker)
May 2017Activity: Talk or presentation types › Academic keynote or plenary lecture
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Atomic layer deposition of AlN from AlCl3 using NH3 and Ar/NH3 plasma as co-reactant
Rontu, V. (Speaker), Sippola, P. (Speaker), Broas, M. (Speaker), Sajavaara, T. (Speaker), Paulasto-Kröckel, M. (Speaker), Lipsanen, H. (Speaker) & Franssila, S. (Speaker)
15 Jul 2017 → 18 Jul 2017Activity: Talk or presentation types › Conference presentation
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High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy
Brand, S. (Speaker), Kögel, M. (Contributor), Ross, G. (Contributor), Vuorinen, V. (Contributor), Paulasto-Kröckel, M. (Contributor) & Petzold, M. (Contributor)
27 Nov 2017 → 29 Nov 2017Activity: Talk or presentation types › Conference presentation
Press/Media
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Study Findings from Aalto University Update Knowledge in Algorithms (Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope)
Ross, G. & Paulasto-Kröckel, M.
06/04/2023
1 item of Media coverage
Press/Media: Media appearance
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Studies from Aalto University in the Area of Technology Described (Impact of Inherent Design Limitations for Cu-sn Slid Microbumps On Its Electromigration Reliability for 3d Ics)
Paulasto-Kröckel, M., Ross, G. & Vuorinen, V.
20/01/2023
1 item of Media coverage
Press/Media: Media appearance