Hongqun Dong

Postdoctoral Researcher

Research outputs

  1. 2018
  2. Published

    The effect of platinum contact metallization on Cu/Sn bonding

    Rautiainen, A., Ross, G., Vuorinen, V., Dong, H. & Paulasto-Kröckel, M., 16 Jul 2018, In : Journal of Materials Science: Materials in Electronics. 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. 2017
  4. Published

    Thermodynamic-Kinetic method on Microstructural Evolutions in Electronics

    Laurila, T., Aloke, P., Dong, H. & Vuorinen, V., 2017, Handbook of Solid State Diffusion: Diffusion Analysis in Material Applications. Aloke, P. & Divinski, S. (eds.). Elsevier, Vol. 2. p. 101-148

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

  5. 2016
  6. Published

    Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection

    Dong, H., Vuorinen, V., Broas, M. & Paulasto-Kröckel, M., 15 Dec 2016, In : Journal of Alloys and Compounds. 688, p. 388-398 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Published

    Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections

    Dong, H., Vuorinen, V., Laurila, T. & Paulasto-Kröckel, M., Oct 2016, In : Journal of Electronic Materials. 45, 10, p. 5478–5486 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Published

    Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)-Sn system

    Baheti, V. A., Islam, S., Kumar, P., Ravi, R., Narayanan, R., Dong, H., Vuorinen, V., Laurila, T. & Paul, A., 2 Jan 2016, In : Philosophical Magazine. 96, 1, p. 15-30 16 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Published

    Design of the Contact Metallizations for Gold-Tin Eutectic Solder-A Thermodynamic-Kinetic Analysis

    Dong, H., 2016, Aalto University. 132 p.

    Research output: ThesisDoctoral ThesisCollection of Articles

  10. Published

    Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

    Dong, H., Vuorinen, V., Liu, X., Laurila, T., Li, J. & Paulasto-Kröckel, M., 2016, In : Journal of Electronic Materials. 45, 1, p. 566-575

    Research output: Contribution to journalArticleScientificpeer-review

  11. 2015
  12. Published

    Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures

    Xu, H., Vuorinen, V., Dong, H. & Paulasto-Kröckel, M., 2015, In : Journal of Alloys and Compounds. 619, january 15, p. 325331

    Research output: Contribution to journalArticleScientificpeer-review

  13. 2014
  14. Published

    Improved Methods for Development of High Reliability Electronics

    Li, J., Dong, H., Vuorinen, V., Karppinen, J., Mattila, T. T. & Paulasto-Kröckel, M., 2014, 2014 IEEE Aerospace Conference, Marck 1-8,2014Yellowstone conference center, Big Sky, Montana.. United States: IEEE

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  15. Published

    Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions

    Santra, S., Dong, H., Laurila, T. & Paul, A., 2014, In : PROCEEDINGS OF THE ROYAL SOCIETY A: MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES. 470, 2161, p. 1-19

    Research output: Contribution to journalArticleScientificpeer-review

  16. Published

    Thermodynamic reassessment of Au-Cu-Sn ternary system

    Dong, H., Vuorinen, V., Tao, X., Laurila, T. & Paulasto-Kröckel, M., 2014, In : Journal of Alloys and Compounds. 588, p. 449-460

    Research output: Contribution to journalArticleScientificpeer-review

  17. 2013
  18. Published

    Reliability of wafer-level SLID bonds for MEMS encapsulation

    Xu, H., Broas, M., Dong, H., Vuorinen, V., Suni, T., Vähänen, S., Monnoyer, P. & Paulasto-Kröckel, M., 2013, Europe Microelectronics Packaging Conference (EMPC2013). Grenoble, France

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  19. Published

    Thermodynamic modeling of Au-Ce-Sn ternary system

    Dong, H., Tao, X., Laurila, T., Vuorinen, V. & Paulasto-Kröckel, M., 2013, In : Calphad: Computer Coupling of Phase Diagrams and Thermochemistry. 42, 42, p. 38-50

    Research output: Contribution to journalArticleScientificpeer-review

  20. Published

    Thermodynamic reassessment of Au-Ni-Sn ternary system

    Dong, H., Vuorinen, V., Laurila, T. & Paulasto-Kröckel, M., 2013, In : Calphad: Computer Coupling of Phase Diagrams and Thermochemistry. 43, p. 61-70

    Research output: Contribution to journalArticleScientificpeer-review

  21. 2012
  22. Published

    Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices

    Vuorinen, V., Dong, H., Xu, H., Vähänen, S., Suni, T., Laurila, T. & Paulasto-Kröckel, M., 2012, ESTC 4th Electronic System-Integration Technology Conference, Sept. 17-20, 2012, Amsterdam. IEEE CPMT

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  23. Published

    Effect of Ti on the interfacial reaction between Sn and Cu

    Vuorinen, V., Dong, H. & Laurila, T., 2012, In : Journal of Materials Science: Materials in Electronics. 23, 1, p. 68-74

    Research output: Contribution to journalArticleScientificpeer-review

  24. Published

    Interfacial reactions between SnAg1.0Ti and Ni metallization

    Laurila, T., Dong, H. & Vuorinen, V., 2012, In : Journal of Materials Science: Materials in Electronics. 23, XX, p. 2030-2034

    Research output: Contribution to journalArticleScientificpeer-review

  25. Published

    Thermodynamic assessment of Au-Ho and Au-Tm binary systems

    Dong, H., Tao, X., Laurila, T. & Paulasto-Kröckel, M., 2012, In : Calphad: Computer Coupling of Phase Diagrams and Thermochemistry. 37, 37, p. 87-93

    Research output: Contribution to journalArticleScientificpeer-review

  26. 2011
  27. Published

    Diffusion and growth of the µ phase (Ni6Nb7) in the Ni-Nb system

    Balam, S. S. K., Dong, H., Laurila, T., Vuorinen, V. & Paul, A., Jul 2011, In : METALLURGICAL AND MATERIALS TRANSACTIONS A: PHYSICAL METALLURGY AND MATERIALS SCIENCE. 42, 7, p. 1727-1731 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  28. Published

    Thermodynamic assessment of Au-La and Au-Er binary systems

    Dong, H., Tao, X. M., Liu, H. S., Laurila, T. & Paulasto-Kröckel, M., 2011, In : Journal of Alloys and Compounds. 509, 13, p. 4439-444

    Research output: Contribution to journalArticleScientificpeer-review

ID: 46708