Glenn Ross

Postdoctoral Researcher

Research outputs

  1. 2019
  2. Published

    Intermetallic Void Formation in Cu-Sn Micro-Connects

    Ross, G., 2019, Aalto University. 128 p.

    Research output: ThesisDoctoral ThesisCollection of Articles

  3. Published

    The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation

    Ross, G., Malmberg, P., Vuorinen, V. & Paulasto-Kröckel, M., 2019, In : ACS Applied Electronic Materials. 1, 1, p. 88-95 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. 2018
  5. Published

    Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

    Vuorinen, V., Ross, G., Viljanen, H., Decker, J. & Paulasto-Krockel, M., 26 Nov 2018, Proceedings of the 2018 7th Electronic System-Integration Technology Conference, ESTC 2018. Institute of Electrical and Electronics Engineers, 6 p. 8546398

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Published

    The effect of platinum contact metallization on Cu/Sn bonding

    Rautiainen, A., Ross, G., Vuorinen, V., Dong, H. & Paulasto-Kröckel, M., 16 Jul 2018, In : Journal of Materials Science: Materials in Electronics. 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Published

    Stability of Piezoelectric Al1-xScxN Thin Films

    Österlund, E., Ross, G. & Paulasto-Kröckel, M., 15 Jan 2018.

    Research output: Contribution to conferencePosterScientific

  8. Published

    Atomic layer deposition of AlN from AlCl3 using NH3 and Ar/NH3 plasma

    Rontu, V., Sippola, P., Broas, M., Ross, G., Lipsanen, H., Paulasto-Kröckel, M. & Franssila, S., Jan 2018, In : JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY A. 36, 2, 021508.

    Research output: Contribution to journalArticleScientificpeer-review

  9. 2017
  10. Published

    Interfacial void segregation of Cl in Cu-Sn micro-connects

    Ross, G., Tao, X., Broas, M., Mäntyoja, N., Vuorinen, V., Graff, A., Altmann, F., Petzold, M. & Paulasto-Kröckel, M., 10 Jul 2017, In : ELECTRONIC MATERIALS LETTERS. 13, 4, p. 307-312 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Published

    Key parameters influencing Cu-Sn interfacial void formation

    Ross, G., Vuorinen, V. & Paulasto-Kröckel, M., 23 Feb 2017, Proceedings of the 18th IEEE Electronics Packaging Technology Conference, EPTC 2016. IEEE, p. 459-467 9 p. (Electronics Packaging Technology Conference Proceedings).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  12. Published

    Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects

    Ross, G., Vuorinen, V., Petzold, M., Paulasto-Kröckel, M. & Brand, S., 2017, In : Applied Physics Letters. 110, 5, 5 p., 054102.

    Research output: Contribution to journalArticleScientificpeer-review

  13. Published

    XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects

    Ross, G., Vuorinen, V., Krause, M., Reissaus, S., Petzold, M. & Paulasto-Kröckel, M., 2017, In : Microelectronics Reliability. 76-77, p. 390-394

    Research output: Contribution to journalArticleScientificpeer-review

  14. 2016
  15. Published

    Void formation and its impact on Cu-Sn intermetallic compound formation

    Ross, G., Vuorinen, V. & Paulasto-Kröckel, M., 25 Aug 2016, In : Journal of Alloys and Compounds. 677, p. 127-138 12 p.

    Research output: Contribution to journalArticleScientificpeer-review

  16. 2015
  17. Published

    Void Formation in Cu-Sn Micro-Connects

    Ross, G., Vuorinen, V. & Paulasto-Kröckel, M., 2015, Electronic Components and Technology Conference (ECTC), San Diego CA, 26-29 May 2015. Keser, B. & Braunisch, H. (eds.). p. 2193-2199 (Electronic Components and Technology Conference).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  18. 2014
  19. Published

    Void formation in Cu-Sn SLID bonding for MEMS

    Ross, G., Xu, H., Vuorinen, V. & Paulasto-Kröckel, M., 18 Nov 2014, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers, 6962843

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

ID: 92877