Glenn Ross

Postdoctoral Researcher

Activities

  1. 2019
  2. LOW TEMPERATURE WAFER-LEVEL CU-IN-SN SOLID LIQUID INTERDIFFUSION BONDING FOR LOW STRESS APPLICATIONS

    Glenn Ross (Speaker), Vesa Vuorinen (Contributor), Joseph Hotchkiss (Contributor), Jani Kaaos (Contributor), Mervi Paulasto-Kröckel (Contributor)
    3 Dec 2019

    Activity: Talk or presentation typesConference presentation

  3. Voids in CuSn 3D/Wafer Bonding

    Glenn Ross (Speaker)
    10 Apr 2019

    Activity: Talk or presentation typesConference presentation

  4. 2017
  5. High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy

    Sebastian Brand (Speaker), Michael Kögel (Contributor), Glenn Ross (Contributor), Vesa Vuorinen (Contributor), Mervi Paulasto-Kröckel (Contributor), Matthias Petzold (Contributor)
    27 Nov 201729 Nov 2017

    Activity: Talk or presentation typesConference presentation

ID: 92877