Research output per year
Research output per year
Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
Education/Academic qualification
Doctoral degree, Engineering and Technology, Aalto University
Award Date: 7 Mar 2019
Master's degree, Engineering and Technology, Aalto University
Award Date: 24 Aug 2015
Bachelor's degree, Engineering and Technology, RMIT University
Award Date: 10 Jul 2006
Fingerprint
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- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration
Tiwary, N., Grosse, C., Kögel, M., Windemuth, T., Ross, G., Vuorinen, V., Brand, S. & Paulasto-Kröckel, M., 2024, 2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings. IEEE, 7 p. ( Electronics System-Integration Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
Open AccessFile80 Downloads (Pure) -
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
Golim, O., Vuorinen, V., Ross, G., Suihkonen, S. & Paulasto-Kröckel, M., Mar 2024, In: Materials Characterization. 209, 113772.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile2 Citations (Scopus)112 Downloads (Pure) -
Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication
Bespalova, K., Ross, G., Suihkonen, S. & Paulasto-Kröckel, M., Apr 2024, In: Advanced Electronic Materials. 10, 4, 8 p., 2300628.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile4 Citations (Scopus)66 Downloads (Pure) -
Scaling of piezoelectric in-plane NEMS : Towards nanoscale integration of AlN-based transducer on vertical sidewalls
Gabrelian, A., Miikkulainen, V., Ross, G. & Paulasto-Kröckel, M., Aug 2024, In: Materials and Design. 244, p. 1-7 7 p., 113116.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile1 Citation (Scopus)28 Downloads (Pure) -
Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces
Nieminen, T., Koskinen, T., Kornienko, V., Ross, G. & Paulasto-Kröckel, M., 23 Apr 2024, In: ACS Applied Electronic Materials. 6, 4, p. 2413-2419 7 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile4 Citations (Scopus)107 Downloads (Pure)
Projects
- 1 Active
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NEMS renewal: Nanoelectromechanical systems (NEMS) renewal a novel NEMS latching switch
Ross, G. (Principal investigator)
01/09/2023 → 31/08/2027
Project: RCF Academy Research Fellow (new)
Datasets
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The Impact of Residual Stress on Resonating Piezoelectric Devices - XRD data
Ross, G. (Creator), Mendeley Data, 24 Aug 2020
DOI: 10.17632/j4xtbtpt3p.1, https://data.mendeley.com/datasets/j4xtbtpt3p
Dataset
Prizes
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Top 3 Student Session Winners
Ross, G. (Recipient), 2017
Prize: Award or honor granted for a specific work
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Vuoden sytyttäjä - Motivator of the year 2017 - 2018
Ross, G. (Recipient), 10 Apr 2018
Prize: Award or honor granted for academic or artistic career
Activities
- 4 Conference presentation
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Low Temperature Wafer-Level Cu-In-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Ross, G. (Invited speaker), Vuorinen, V. (Contributor) & Paulasto-Kröckel, M. (Contributor)
4 Oct 2020 → 9 Oct 2020Activity: Talk or presentation types › Conference presentation
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Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications
Ross, G. (Speaker), Vuorinen, V. (Contributor), Hotchkiss, J. (Contributor), Kaaos, J. (Contributor) & Paulasto-Kröckel, M. (Contributor)
3 Dec 2019Activity: Talk or presentation types › Conference presentation
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Voids in CuSn 3D/Wafer Bonding
Ross, G. (Speaker)
10 Apr 2019Activity: Talk or presentation types › Conference presentation
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High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy
Brand, S. (Speaker), Kögel, M. (Contributor), Ross, G. (Contributor), Vuorinen, V. (Contributor), Paulasto-Kröckel, M. (Contributor) & Petzold, M. (Contributor)
27 Nov 2017 → 29 Nov 2017Activity: Talk or presentation types › Conference presentation
Press/Media
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Study Findings from Aalto University Update Knowledge in Algorithms (Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope)
Ross, G. & Paulasto-Kröckel, M.
06/04/2023
1 item of Media coverage
Press/Media: Media appearance
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Studies from Aalto University in the Area of Technology Described (Impact of Inherent Design Limitations for Cu-sn Slid Microbumps On Its Electromigration Reliability for 3d Ics)
Paulasto-Kröckel, M., Ross, G. & Vuorinen, V.
20/01/2023
1 item of Media coverage
Press/Media: Media appearance