Research output per year
Research output per year
Personal profile
Education/Academic qualification
Doctoral degree, Engineering and Technology, Aalto University
Award Date: 7 Mar 2019
Master's degree, Engineering and Technology, Aalto University
Award Date: 24 Aug 2015
Bachelor's degree, Engineering and Technology, RMIT University
Award Date: 10 Jul 2006
Fingerprint
Dive into the research topics where Glenn Ross is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Network
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
-
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Golim, O., Vuorinen, V., Ross, G., Wernicke, T., Pawlak, M., Tiwary, N. & Paulasto-Kröckel, M., 1 Jan 2023, In: Scripta Materialia. 222, 3 p., 114998.Research output: Contribution to journal › Letter › Scientific › peer-review
Open AccessFile18 Downloads (Pure) -
Aluminium corrosion in power semiconductor devices
Leppänen, J., Ingman, J., Peters, J. H., Hanf, M., Ross, R., Koopmans, G., Jormanainen, J., Forsström, A., Ross, G., Kaminski, N. & Vuorinen, V., Oct 2022, In: Microelectronics Reliability. 137, 9 p., 114766.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile10 Downloads (Pure) -
Finite element simulation of solid-liquid interdiffusion bonding process: Understanding process dependent thermomechanical stress
Tiwary, N., Vuorinen, V., Ross, G. & Paulasto-Krockel, M., 1 May 2022, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12, 5, p. 847-856 10 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile1 Citation (Scopus)15 Downloads (Pure) -
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
Emadi, F., Vuorinen, V., Dong, H., Ross, G. & Paulasto-Kröckel, M., 15 Jan 2022, In: Journal of Alloys and Compounds. 890, 10 p., 161852.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile1 Citation (Scopus)29 Downloads (Pure) -
Unlocking the Potential of Piezoelectric Films Grown on Vertical Surfaces for Inertial MEMS
Gabrelian, G., Ross, G., Bespalova, K. & Paulasto-Kröckel, M., Dec 2022, In: Materials Today Communications. 33, 10 p., 104522.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile
-
iRel40: Intelligent Reliability 4.0
Paulasto-Kröckel, M., Ross, G., Emadi, F., Tiwary, N. & Liu, S.
01/05/2020 → 30/04/2023
Project: Business Finland: Other research funding
-
NewControl: Integrated, Fail- Operational, Cognitive Perception and Control Systems for Highly Automated Vehicles
Paulasto-Kröckel, M., Kaaos, J., Ross, G., Bespalova, K., Nieminen, T., Rathore, J. & Gabrelian, G.
01/05/2019 → 31/12/2022
Project: Business Finland: Other research funding
-
Beyond SOI: Silicon microfabrication platform development for next generation products
Paulasto-Kröckel, M., Ross, G., Bespalova, K., Kaaos, J. & Emadi, F.
01/05/2019 → 31/12/2021
Project: Business Finland: Other research funding
-
APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe
Paulasto-Kröckel, M., Ross, G., Golim, O., Emadi, F., Nieminen, T., Tiwary, N. & Vuorinen, V.
01/05/2019 → 31/10/2022
Project: Business Finland: Other research funding
Datasets
-
The Impact of Residual Stress on Resonating Piezoelectric Devices - XRD data
Ross, G. (Contributor), Mendeley Data, 24 Aug 2020
DOI: 10.17632/j4xtbtpt3p.1, https://data.mendeley.com/datasets/j4xtbtpt3p
Dataset
Prizes
-
Top 3 Student Session Winners
Ross, Glenn (Recipient), 2017
Prize: Award or honor granted for a specific work
-
Vuoden sytyttäjä - Motivator of the year 2017 - 2018
Ross, Glenn (Recipient), 10 Apr 2018
Prize: Award or honor granted for academic or artistic career
Activities
- 4 Conference presentation
-
Low Temperature Wafer-Level Cu-In-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Glenn Ross (Invited speaker), Vesa Vuorinen (Contributor) & Mervi Paulasto-Kröckel (Contributor)
4 Oct 2020 → 9 Oct 2020Activity: Talk or presentation types › Conference presentation
-
Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications
Glenn Ross (Speaker), Vesa Vuorinen (Contributor), Joseph Hotchkiss (Contributor), Jani Kaaos (Contributor) & Mervi Paulasto-Kröckel (Contributor)
3 Dec 2019Activity: Talk or presentation types › Conference presentation
-
Voids in CuSn 3D/Wafer Bonding
Glenn Ross (Speaker)
10 Apr 2019Activity: Talk or presentation types › Conference presentation
-
High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy
Sebastian Brand (Speaker), Michael Kögel (Contributor), Glenn Ross (Contributor), Vesa Vuorinen (Contributor), Mervi Paulasto-Kröckel (Contributor) & Matthias Petzold (Contributor)
27 Nov 2017 → 29 Nov 2017Activity: Talk or presentation types › Conference presentation