Research output per year
Research output per year
Personal profile
Education/Academic qualification
Doctoral degree, Engineering and Technology, Aalto University
Award Date: 7 Mar 2019
Master's degree, Engineering and Technology, Aalto University
Award Date: 24 Aug 2015
Bachelor's degree, Engineering and Technology, RMIT University
Award Date: 10 Jul 2006
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Dive into the research topics where Glenn Ross is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Network
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
Emadi, F., Vuorinen, V., Dong, H., Ross, G. & Paulasto-Kröckel, M., 15 Jan 2022, In: Journal of Alloys and Compounds. 890, 10 p., 161852.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile5 Downloads (Pure) -
A humidity-induced novel failure mechanism in power semiconductor diodes
Leppänen, J., Ross, G., Vuorinen, V., Ingman, J., Jormanainen, J. & Paulasto-Kröckel, M., Aug 2021, In: Microelectronics Reliability. 123, 7 p., 114207.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile56 Downloads (Pure) -
Aluminum Nitride to Silicon Direct Bonding for an Alternative Silicon-On-Insulator Platform
Kaaos, J., Ross, G. & Paulasto-Kröckel, M., 18 Aug 2021, In: ACS applied materials & interfaces. 13, 32, p. 38857-38865 9 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile10 Downloads (Pure) -
Characterization of AlScN-Based Multilayer Systems for Piezoelectric Micromachined Ultrasound Transducer (pMUT) Fabrication
Bespalova, K., österlund, E., Ross, G., Paulasto-Kröckel, M., Sebastian, A. T., Karuthedath, C. B., Mertin, S. & Pensala, T., Apr 2021, In: Journal of Microelectromechanical Systems. 30, 2, p. 290-298 9 p., 9354444.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile1 Citation (Scopus)57 Downloads (Pure) -
Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding
Vuorinen, V., Ross, G., Klami, A., Dong, H., Paulasto-Kröckel, M., Wernicke, T. & Pönninger, A., 9 Sep 2021, (E-pub ahead of print) In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open Access
Projects
- 3 Active
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iRel40: Intelligent Reliability 4.0
Paulasto-Kröckel, M., Ross, G. & Tiwary, N.
01/05/2020 → 30/04/2023
Project: Business Finland: Other research funding
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Beyond SOI: Silicon microfabrication platform development for next generation products
Paulasto-Kröckel, M., Bespalova, K., Emadi, F., Ross, G. & Kaaos, J.
01/05/2019 → 31/12/2021
Project: Business Finland: Other research funding
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NewControl: Integrated, Fail- Operational, Cognitive Perception and Control Systems for Highly Automated Vehicles
Paulasto-Kröckel, M., Ross, G., Nieminen, T., Rathore, J., Kaaos, J. & Gabrelian, G.
01/05/2019 → 31/12/2022
Project: Business Finland: Other research funding
Datasets
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The Impact of Residual Stress on Resonating Piezoelectric Devices - XRD data
Ross, G. (Contributor), Mendeley Data, 24 Aug 2020
DOI: 10.17632/j4xtbtpt3p.1, https://data.mendeley.com/datasets/j4xtbtpt3p
Dataset
Prizes
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Top 3 Student Session Winners
Ross, Glenn (Recipient), 2017
Prize: Award or honor granted for a specific work
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Vuoden sytyttäjä - Motivator of the year 2017 - 2018
Ross, Glenn (Recipient), 10 Apr 2018
Prize: Award or honor granted for academic career
Activities
- 4 Conference presentation
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Low Temperature Wafer-Level Cu-In-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Glenn Ross (Invited speaker), Vesa Vuorinen (Contributor) & Mervi Paulasto-Kröckel (Contributor)
4 Oct 2020 → 9 Oct 2020Activity: Talk or presentation types › Conference presentation
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Voids in CuSn 3D/Wafer Bonding
Glenn Ross (Speaker)
10 Apr 2019Activity: Talk or presentation types › Conference presentation
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Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications
Glenn Ross (Speaker), Vesa Vuorinen (Contributor), Joseph Hotchkiss (Contributor), Jani Kaaos (Contributor) & Mervi Paulasto-Kröckel (Contributor)
3 Dec 2019Activity: Talk or presentation types › Conference presentation
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High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy
Sebastian Brand (Speaker), Michael Kögel (Contributor), Glenn Ross (Contributor), Vesa Vuorinen (Contributor), Mervi Paulasto-Kröckel (Contributor) & Matthias Petzold (Contributor)
27 Nov 2017 → 29 Nov 2017Activity: Talk or presentation types › Conference presentation