Research output per year
Research output per year
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Dive into the research topics where Fahimeh Emadi is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
Emadi, F., Vuorinen, V., Ross, G. & Paulasto-Kröckel, M., 10 Aug 2023, In: Materials Science and Engineering: A. 881, 8 p., 145398.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile7 Downloads (Pure) -
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
Emadi, F., Vuorinen, V., Dong, H., Ross, G. & Paulasto-Kröckel, M., 15 Jan 2022, In: Journal of Alloys and Compounds. 890, 10 p., 161852.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile3 Citations (Scopus)46 Downloads (Pure) -
Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding
Emadi, F., Liu, S., Klami, A., Tiwary, N., Vuorinen, V. & Paulasto-Krockel, M., 2022, ASDAM 2022 - Proceedings: 14th International Conference on Advanced Semiconductor Devices and Microsystems. Marek, J., Donoval, D. & Vavrinsky, E. (eds.). IEEE, 6 p. (Conference proceedings (International conference on advanced semiconductor devices and microsystems)).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review
Open AccessFile1 Citation (Scopus)5 Downloads (Pure) -
Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer
Emadi, F., Vuorinen, V., Mertin, S., Widell, K. & Paulasto-Kröckel, M., 25 Dec 2022, In: Journal of Alloys and Compounds. 929, 12 p., 167228.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile3 Citations (Scopus)98 Downloads (Pure) -
Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging
Emadi, F., Vuorinen, V. & Paulasto-Kröckel, M., 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. IEEE, p. 359-363 5 p. (2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review
Open AccessFile1 Citation (Scopus)17 Downloads (Pure)
Projects
- 3 Finished
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iRel 40: Intelligent Reliability 4.0
Paulasto-Kröckel, M., Emadi, F., Liu, S., Ross, G. & Tiwary, N.
01/05/2020 → 31/10/2023
Project: Business Finland: Other research funding
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APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe
Paulasto-Kröckel, M., Emadi, F., Nieminen, T., Ross, G., Tiwary, N., Golim, O. & Vuorinen, V.
01/05/2019 → 31/10/2022
Project: Business Finland: Other research funding
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Beyond SOI: Silicon microfabrication platform development for next generation products
Paulasto-Kröckel, M., Emadi, F., Bespalova, K., Kaaos, J. & Ross, G.
01/05/2019 → 31/12/2021
Project: Business Finland: Other research funding