Projects per year
Collaborations and top research areas from the last five years
Profiles
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Arsam Ali
- Department of Electrical Engineering and Automation - Doctoral Researcher
- School of Electrical Engineering
- Electronics Integration and Reliability - Doctoral Researcher
Person: Doctoral students, Doctoral Student
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Gabrelian Gabrelian
- Department of Electrical Engineering and Automation - Project Employee
- School of Electrical Engineering
- Electronics Integration and Reliability - Project Employee
Person: Project research staff, Doctoral Student
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Shenyi Liu
- Department of Electrical Engineering and Automation - Doctoral Researcher
- School of Electrical Engineering
- Electronics Integration and Reliability - Doctoral Researcher
Person: Doctoral students, Doctoral Student
Projects
- 5 Finished
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Power2Power: The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade
Paulasto-Kröckel, M. (Principal investigator), Tiwary, N. (Project Member), Vuorinen, V. (Project Member), Gabrelian, G. (Project Member), Liu, S. (Project Member) & Klami, A. (Project Member)
01/06/2019 → 30/09/2022
Project: Business Finland: Other research funding
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-: Integrated Fail-Operational, Adaptive Perception and Control Systems for Highly Automated Vehicles
Paulasto-Kröckel, M. (Principal investigator), Gabrelian, G. (Project Member), Rathore, J. (Project Member), Haavisto, J. (Project Member), Bespalova, K. (Project Member), Ross, G. (Project Member), Nieminen, T. (Project Member) & Kaaos, J. (Project Member)
01/05/2019 → 31/03/2023
Project: Business Finland: Other research funding
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APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe
Paulasto-Kröckel, M. (Principal investigator), Vuorinen, V. (Project Member), Emadi, F. (Project Member), Nieminen, T. (Project Member), Ross, G. (Project Member), Tiwary, N. (Project Member), Hotchkiss, J. (Project Member), Klami, A. (Project Member) & Golim, O. (Project Member)
01/05/2019 → 31/10/2022
Project: Business Finland: Other research funding
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A comparative study of non-destructive techniques for estimating dislocation densities in heteroepitaxial AlN layers
Patočka, M., Tiwary, N., Suihkonen, S. & Paulasto-Kröckel, M., 17 Apr 2026, In: Journal of Applied Physics. 139, 15, 11 p., 155706.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile16 Downloads (Pure) -
Effect of Dynamic Backplate-to-Conductor Biasing on Dendritic Corrosion in Power Module Corrosive Gas Testing
Rautio, J., Leppänen, J., Kärkkäinen, T. J., Ingman, J., Liu, S. & Kovanen, H., 1 Jan 2026, In: IET Power Electronics. 19, 1, e70312.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile1 Downloads (Pure) -
Comparison and Optimization of SLID Bonding for Die-attach on Various Substrate Types in Power Module Packaging Applications
Liu, S., Vuorinen, V., Schuh, J., Albrecht, J. & Paulasto-Krockel, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile50 Downloads (Pure)
Datasets
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The Impact of Residual Stress on Resonating Piezoelectric Devices - XRD data
Ross, G. (Creator), Mendeley Data, 24 Aug 2020
DOI: 10.17632/j4xtbtpt3p.1, https://data.mendeley.com/datasets/j4xtbtpt3p
Dataset
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Supporting data for the manuscript "A comparative study of non-destructive techniques for estimating dislocation densities in heteroepitaxial AlN layers"
Patočka, M. (Creator), Tiwary, N. (Creator), Suihkonen, S. (Creator) & Paulasto-Kröckel, M. (Creator), Zenodo, 20 Jan 2026
Dataset
Prizes
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JVST A Best ALD Paper Award
Österlund, E. (Recipient), Seppänen, H. (Recipient), Bespalova, K. (Recipient), Miikkulainen, K. (Recipient) & Paulasto-Kröckel, M. (Recipient), 28 Jun 2021
Prize: Award or honor granted for a specific work
Activities
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Low Temperature Wafer-Level Cu-In-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Ross, G. (Invited speaker), Vuorinen, V. (Contributor) & Paulasto-Kröckel, M. (Contributor)
4 Oct 2020 → 9 Oct 2020Activity: Talk or presentation types › Conference presentation
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Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications
Ross, G. (Speaker), Vuorinen, V. (Contributor), Hotchkiss, J. (Contributor), Kaaos, J. (Contributor) & Paulasto-Kröckel, M. (Contributor)
3 Dec 2019Activity: Talk or presentation types › Conference presentation
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High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy
Brand, S. (Speaker), Kögel, M. (Contributor), Ross, G. (Contributor), Vuorinen, V. (Contributor), Paulasto-Kröckel, M. (Contributor) & Petzold, M. (Contributor)
27 Nov 2017 → 29 Nov 2017Activity: Talk or presentation types › Conference presentation
Press/Media
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Study Findings from Aalto University Update Knowledge in Algorithms (Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope)
Ross, G. & Paulasto-Kröckel, M.
06/04/2023
1 item of Media coverage
Press/Media: Media appearance
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Studies from Aalto University in the Area of Technology Described (Impact of Inherent Design Limitations for Cu-sn Slid Microbumps On Its Electromigration Reliability for 3d Ics)
Paulasto-Kröckel, M., Ross, G. & Vuorinen, V.
20/01/2023
1 item of Media coverage
Press/Media: Media appearance