Projects per year
UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. Our work contributes towards the following SDG(s):
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Profiles
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Arsam Ali
- Department of Electrical Engineering and Automation - Doctoral Researcher
- School common, ELEC
- Electronics Integration and Reliability - Doctoral Researcher
Person: Doctoral students, Doctoral Student
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Kristina Bespalova
- Department of Electrical Engineering and Automation - Project Employee
- Electronics Integration and Reliability - Project Employee
Person: Project research staff
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Fahimeh Emadi
- Department of Electrical Engineering and Automation - Visitor (Doctoral Researcher)
- School common, ELEC
- Electronics Integration and Reliability - Visitor (Doctoral Researcher)
Person: Doctoral Student , Visiting Scholar
Projects
- 5 Finished
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Power2Power: The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade
Paulasto-Kröckel, M. (Principal investigator), Gabrelian, G. (Project Member), Liu, S. (Project Member), Tiwary, N. (Project Member), Vuorinen, V. (Project Member) & Nieminen, T. (Project Member)
01/06/2019 → 30/09/2022
Project: Business Finland: Other research funding
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APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe
Paulasto-Kröckel, M. (Principal investigator), Emadi, F. (Project Member), Nieminen, T. (Project Member), Ross, G. (Project Member), Tiwary, N. (Project Member), Golim, O. (Project Member) & Vuorinen, V. (Project Member)
01/05/2019 → 31/10/2022
Project: Business Finland: Other research funding
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-: Integrated Fail-Operational, Adaptive Perception and Control Systems for Highly Automated Vehicles
Paulasto-Kröckel, M. (Principal investigator), Gabrelian, G. (Project Member), Ross, G. (Project Member), Kaaos, J. (Project Member), Bespalova, K. (Project Member), Nieminen, T. (Project Member) & Rathore, J. (Project Member)
01/05/2019 → 31/03/2023
Project: Business Finland: Other research funding
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Bonding of ceramics to silver-coated titanium—A combined theoretical and experimental study
Vuorinen, V., Kouhia, R., Könönen, M. & Kivilahti, J. K., May 2024, In: Journal of Biomedical Materials Research - Part B Applied Biomaterials. 112, 5, e35407.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile28 Downloads (Pure) -
Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test
Liu, S., Vuorinen, V., Liu, X., Fredrikson, O., Brand, S., Tiwary, N., Lutz, J. & Paulasto-Krockel, M., Aug 2024, (E-pub ahead of print) In: IEEE Transactions on Power Electronics. p. 1-13 13 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open Access -
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
Golim, O., Vuorinen, V., Ross, G., Suihkonen, S. & Paulasto-Kröckel, M., Mar 2024, In: Materials Characterization. 209, 113772.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile50 Downloads (Pure)
Datasets
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The Impact of Residual Stress on Resonating Piezoelectric Devices - XRD data
Ross, G. (Creator), Mendeley Data, 24 Aug 2020
DOI: 10.17632/j4xtbtpt3p.1, https://data.mendeley.com/datasets/j4xtbtpt3p
Dataset
Prizes
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JVST A Best ALD Paper Award
Österlund, E. (Recipient), Seppänen, H. (Recipient), Bespalova, K. (Recipient), Miikkulainen, K. (Recipient) & Paulasto-Kröckel, M. (Recipient), 28 Jun 2021
Prize: Award or honor granted for a specific work
Activities
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Low Temperature Wafer-Level Cu-In-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Glenn Ross (Invited speaker), Vesa Vuorinen (Contributor) & Mervi Paulasto-Kröckel (Contributor)
4 Oct 2020 → 9 Oct 2020Activity: Talk or presentation types › Conference presentation
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Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications
Ross, G. (Speaker), Vuorinen, V. (Contributor), Hotchkiss, J. (Contributor), Kaaos, J. (Contributor) & Paulasto-Kröckel, M. (Contributor)
3 Dec 2019Activity: Talk or presentation types › Conference presentation
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Keynote talk, at Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum
Mervi Paulasto-Kröckel (Keynote speaker)
May 2017Activity: Talk or presentation types › Academic keynote or plenary lecture
Press/Media
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Study Findings from Aalto University Update Knowledge in Algorithms (Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope)
Glenn Ross & Mervi Paulasto-Kröckel
06/04/2023
1 item of Media coverage
Press/Media: Media appearance
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Studies from Aalto University in the Area of Technology Described (Impact of Inherent Design Limitations for Cu-sn Slid Microbumps On Its Electromigration Reliability for 3d Ics)
Mervi Paulasto-Kröckel, Glenn Ross & Vesa Vuorinen
20/01/2023
1 item of Media coverage
Press/Media: Media appearance