Projects per year
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Profiles
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Kristina Bespalova
- School common, ELEC
- Electronics Integration and Reliability - Doctoral Candidate
- Department of Electrical Engineering and Automation - Doctoral Candidate
Person: Doctoral students, Doctoral studies
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Fahimeh Emadi
- School common, ELEC
- Electronics Integration and Reliability - Doctoral Candidate
- Department of Electrical Engineering and Automation - Doctoral Candidate
Person: Doctoral students, Doctoral studies
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Mervi Paulasto-Kröckel
- Electronics Integration and Reliability
- Department of Electrical Engineering and Automation - Professor (Associate Professor)
Person: Professors, tenure track
Projects
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Power2Power: The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade
Paulasto-Kröckel, M., Vuorinen, V. & Tiwary, N.
01/06/2019 → 30/11/2022
Project: Business Finland: Other research funding
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NewControl: Integrated, Fail- Operational, Cognitive Perception and Control Systems for Highly Automated Vehicles
Haavisto, J., Paulasto-Kröckel, M., Ross, G. & Kaaos, J.
01/05/2019 → 30/04/2023
Project: Business Finland: Other research funding
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APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe
Paulasto-Kröckel, M., Vuorinen, V. & Golim, O.
01/05/2019 → 31/10/2022
Project: Business Finland: Other research funding
Research Output
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Deposition and characterization of aluminum nitride thin films for piezoelectric MEMS
Österlund, E., 2020, Aalto University. 163 p.Research output: Thesis › Doctoral Thesis › Collection of Articles
Open Access -
Metalorganic chemical vapor deposition of aluminum nitride on vertical surfaces
Österlund, E., Suihkonen, S., Ross, G., Torkkeli, A., Kuisma, H. & Paulasto-Kröckel, M., 1 Feb 2020, In : Journal of Crystal Growth. 531, 10 p., 125345.Research output: Contribution to journal › Article › Scientific › peer-review
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MOCVD Al(Ga)N Insulator for Alternative Silicon-On-Insulator Structure
Ross, G., Luntinen, V., Broas, M., Suihkonen, S., Tuomi, T., Lankinen, A., Danilewsky, A., Tilli, M. & Paulasto-Kröckel, M., 15 Sep 2020, Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020. IEEE, 6 p. 9229836Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review
Open AccessFile
Activities
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Low Temperature Wafer-Level Cu-In-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Glenn Ross (Invited speaker), Vesa Vuorinen (Contributor) & Mervi Paulasto-Kröckel (Contributor)
4 Oct 2020 → 9 Oct 2020Activity: Talk or presentation types › Conference presentation
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Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications
Glenn Ross (Speaker), Vesa Vuorinen (Contributor), Joseph Hotchkiss (Contributor), Jani Kaaos (Contributor) & Mervi Paulasto-Kröckel (Contributor)
3 Dec 2019Activity: Talk or presentation types › Conference presentation
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Keynote talk, at Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum
Mervi Paulasto-Kröckel (Keynote speaker)
May 2017Activity: Talk or presentation types › Keynote or plenary lecture