Microelectronics Reliability

Research outputs

  1. 2017
  2. Published

    XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects

    Ross, G., Vuorinen, V., Krause, M., Reissaus, S., Petzold, M. & Paulasto-Kröckel, M., 2017, In : Microelectronics Reliability. 76-77, p. 390-394

    Research output: Contribution to journalArticleScientificpeer-review

  3. 2016
  4. Published

    Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures

    Broas, M., Graff, A., Simon-Najasek, M., Poppitz, D., Altmann, F., Jung, H. & Blanck, H., 1 Sep 2016, In : Microelectronics Reliability. 64, p. 541-546 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Published

    Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bonds

    Vuorinen, V., Rautiainen, A., Heikkinen, H. & Paulasto-Kröckel, M., 1 Sep 2016, In : Microelectronics Reliability. 64, p. 676-680 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Published

    Piezoelectric oscillating cantilever fan for thermal management of electronics and LEDs — A review

    Maaspuro, M., 1 Aug 2016, In : Microelectronics Reliability. 63, p. 342-353 12 p.

    Research output: Contribution to journalReview ArticleScientificpeer-review

  7. 2014
  8. Published

    Evaluation of the drop response of handheld electronic products

    Mattila, T. T., Vajavaara, L., Hokka, J., Hussa, E., Mäkelä, M. & Halkola, V., Mar 2014, In : Microelectronics Reliability. 54, 3, p. 601-609 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Published

    An approach to adjust the board-level drop test conditions to improve the correlation with product-level drop impact

    Mattila, T. T., Ruotoistenmäki, H., Raami, J., Hokka, J., Mäkelä, M., Hussa, E., Sillanpää, M. & Halkola, V., 2014, In : Microelectronics Reliability. 54, 4, p. 785-795 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Published

    Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading

    Li, J., Broas, M., Raami, J., Mattila, T. T. & Paulasto-Kröckel, M., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1228-1234

    Research output: Contribution to journalArticleScientificpeer-review

  11. 2013
  12. Published

    Thermal analysis of LED spot lighting device operating in external natural or forced heat convection

    Maaspuro, M. & Tuominen, A., Mar 2013, In : Microelectronics Reliability. 53, 3, p. 428-434 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  13. 2012
  14. Published

    A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive

    Li, J., Turunen, M., Niiranen, S., Chen, H. & Paulasto-Kröckel, M., 2012, In : Microelectronics Reliability. 52, Dec., p. 29622969

    Research output: Contribution to journalArticleScientificpeer-review

  15. Published

    Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing

    Chen, H., Han, J., Li, J. & Li, M., 2012, In : Microelectronics Reliability. 52, 1, p. 1112-1120

    Research output: Contribution to journalArticleScientificpeer-review

  16. Published

    On the effects of temperature on the drop reliability of electronic component boards

    Mattila, T. T., Li, J. & Kivilahti, J. K., 2012, In : Microelectronics Reliability. 52, 1, p. 165-179

    Research output: Contribution to journalArticleScientificpeer-review

  17. Published

    Shock impact reliability characterization of a handheld product in accelerated tests and use environment

    Karppinen, J., Li, J., Pakarinen, J., Mattila, T. & Paulasto-Kröckel, M., 2012, In : Microelectronics Reliability. 52, 1, p. 190-198

    Research output: Contribution to journalArticleScientificpeer-review

  18. Published

    The reliability of component boards studied with different shock impact repetition frequencies

    Hokka, J., Li, J. & Mattila, T., 2012, In : Microelectronics Reliability. 52, 7, p. 1445-1453

    Research output: Contribution to journalArticleScientificpeer-review

  19. 2011
  20. Published

    Toward comprehensive reliability assessment of electronics by a combined loading approach

    Mattila, T. T. & Paulasto-Kröckel, M., Jun 2011, In : Microelectronics Reliability. 51, 6, p. 1077-1091 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  21. Published

    Toward comprehensive reliability assessment of electronic component boards by a combined loading approach

    Mattila, T. T. & Paulasto-Kröckel, M., 2011, In : Microelectronics Reliability. 51, 6, p. 1077-1091

    Research output: Contribution to journalArticleScientificpeer-review

  22. 2010
  23. Published

    A novel impact test system for more efficient reliability testing

    Hokka, J., Mattila, T. T., Teeri, J. & Kivilahti, J., 2010, In : Microelectronics Reliability. 50, 8, p. 1125-1133

    Research output: Contribution to journalArticleScientificpeer-review

  24. Published

    Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment

    Karppinen, J., Mattila, T. T., Li, J. & Paulasto-Kröckel, M., 2010, In : Microelectronics Reliability. 50, 12, p. 1994-2000

    Research output: Contribution to journalArticleScientificpeer-review

  25. 2009
  26. Published

    Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers

    Laurila, T., Hurtig, J., Vuorinen, V. & Kivilahti, J., Mar 2009, In : Microelectronics Reliability. 49, 3, p. 242-247 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  27. 2007
  28. Published

    Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests

    Laurila, T., Mattila, T., Vuorinen, V., Karppinen, J., Li, J., Sippola, M. & Kivilahti, J., Jul 2007, In : Microelectronics Reliability. 47, 7, p. 1135-1144 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  29. 2005
  30. Published

    Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate

    Waris, T. F., Turunen, M. P. K., Laurila, T. & Kivilahti, J. K., Mar 2005, In : Microelectronics Reliability. 45, 3-4, p. 665-673 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  31. 2004
  32. Published

    Determination of Thermal transitions of thin polymeric films from refractive index data

    Turunen, M. P. K., Marjamäki, P., Paajanen, M., Lahtinen, M. & Kivilahti, J. K., 2004, In : Microelectronics Reliability. 44, p. 993-1007

    Research output: Contribution to journalArticleScientificpeer-review

  33. Published

    Pull-off test in the assessement of adhesion at printed wiring board metallisation/epoxy interface

    Turunen, M. P. K., Marjamäki, P., Paajanen, M., Lahtinen, J. & Kivilahti, J. K., 2004, In : Microelectronics Reliability. 44, p. 993-1007

    Research output: Contribution to journalArticleScientificpeer-review

  34. 2002
  35. Published

    Neural analysis of integrated circuit yield dependence on CMOS process control parameters

    Karilahti, M., 2002, In : Microelectronics Reliability. 00, p. 00-00

    Research output: Contribution to journalArticleScientificpeer-review

ID: 339487