Journal of Electronic Materials

Research outputs

  1. 2017
  2. Published

    Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates

    Rautiainen, A., Vuorinen, V. & Paulasto-Kröckel, M., 1 Apr 2017, In : Journal of Electronic Materials. 46, 4, p. 2323-2333 11 p.

    Research output: Contribution to journalArticle

  3. 2016
  4. Published
  5. Published
  6. 2015
  7. Published

    Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation

    Rautiainen, A., Xu, H., Österlund, E., Li, J., Vuorinen, V. & Paulasto-Kröckel, M., 2015, In : Journal of Electronic Materials. 44, 11, p. 4533-4548

    Research output: Contribution to journalArticle

  8. 2014
  9. Published

    The reliability of microalloyed Sn-Ag-Cu solder interconnections under cyclic thermal and mechanical shock loading

    Mattila, T. T., Hokka, J. & Paulasto-Kröckel, M., 1 Nov 2014, In : Journal of Electronic Materials. 43, 11, p. 4090-4102 13 p.

    Research output: Contribution to journalArticle

  10. Published

    Phase evolution in the AuCu/Sn system by solid-state reactive diffusion

    Santra, S., Islam, S., Ravi, R., Vuorinen, V., Laurila, T. & Paul, A., 2014, In : Journal of Electronic Materials. 43, 9, p. 3357-3371 15 p.

    Research output: Contribution to journalArticle

  11. 2013
  12. Published

    Corrosion behavior of Pb-free Sn-1Ag-0.5Cu-XNi solder alloys in 3.5% NaCl solution

    Mohanty, U. S. & Lin, K. L., Apr 2013, In : Journal of Electronic Materials. 42, 4, p. 628-638 11 p.

    Research output: Contribution to journalArticle

  13. Published

    Effect of Ag on the microstructure of Sn-8.5Zn-xAg-0.01Al-0.1Ga solders under high-temperature and high-humidity conditions

    Yeh, T. K., Mohanty, U. S. & Lin, K. L., Apr 2013, In : Journal of Electronic Materials. 42, 4, p. 616-627 12 p.

    Research output: Contribution to journalArticle

  14. Published

    Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections.Part 1: Effects of Test Parameters

    Hokka, J., Mattila, T. T., Xu, H. & Paulasto-Kröckel, M., 2013, In : Journal of Electronic Materials. 42, 6, p. 1171-1183

    Research output: Contribution to journalArticle

  15. Published

    Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections-Part 2: Failure Mechanisms

    Hokka, J., Mattila, T. T., Xu, H. & Paulasto-Kröckel, M., 2013, In : Journal of Electronic Materials. 42, 6, p. 963-972

    Research output: Contribution to journalArticle

  16. 2012
  17. Published
  18. Published
  19. Published
  20. Published
  21. 2011
  22. Published

    Increase in the Thermoelectric Efficiency of the Disordered Phase of Layered Antiferromagnetic CuCrS2

    Tewari, G. C., Tripathi, T. S., Kumar, P., Rastogi, A. K., Pasha, S. K. & Gupta, G., 1 Dec 2011, In : Journal of Electronic Materials. 40, 12, p. 2368-2373 6 p.

    Research output: Contribution to journalArticle

  23. Published
  24. 2010
  25. Published

    Thermoelectric properties of layer-antiferromagnet CuCrS2

    Tewari, G. C., Tripathi, T. S. & Rastogi, A. K., 1 Aug 2010, In : Journal of Electronic Materials. 39, 8, p. 1133-1139 7 p.

    Research output: Contribution to journalArticle

  26. Published

    Multiscale Simulation of Microstructural Changes in Solder Interconnections During Thermal Cycling

    Li, J., Mattila, T. & Kivilahti, J., 2010, In : Journal of Electronic Materials. 39, 1, p. 77-84

    Research output: Contribution to journalArticle

  27. Published

    Multiscale simulation of recrystallization and grain growth of Sn in lead-free solder interconnections

    Li, J., Mattila, T. T. & Kivilahti, J., 2010, In : Journal of Electronic Materials. 39, 1, p. 77-84

    Research output: Contribution to journalArticle

  28. 2008
  29. Published

    Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations

    Vuorinen, V., Yu, H., Laurila, T. & Kivilahti, J., Jun 2008, In : Journal of Electronic Materials. 37, 6, p. 792-805 14 p.

    Research output: Contribution to journalArticle

  30. 2007
  31. Published

    Solid-state reactions between Cu(Ni) alloys and Sn

    Vuorinen, V., Laurila, T., Mattila, T., Heikinheimo, E. & Kivilahti, J., Oct 2007, In : Journal of Electronic Materials. 36, 10, p. 1355-1362 8 p.

    Research output: Contribution to journalArticle

  32. Published

    Solder/Substrate Interfacial Reactions in Sn-Cu-Ni Interconnection System

    Yu, H., Vuorinen, V. & Kivilahti, J., 2007, In : Journal of Electronic Materials. 36, 2, p. 136-146

    Research output: Contribution to journalArticle

  33. 2006
  34. Published

    Electroless nickel plating process model for plated-through-hole board manufacturing

    Tenno, R., Kantola, K. & Tenno, A., 2006, In : Journal of Electronic Materials. 35, 10, p. 1825-1836

    Research output: Contribution to journalArticle

  35. Published

    Reliability lead-free interconnections under consecutive thermal and mechanical loadings

    Mattila, T. T. & Kivilahti, J. K., 2006, In : Journal of Electronic Materials. 35, 2, p. 250-255

    Research output: Contribution to journalArticle

  36. 2005
  37. Published

    Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders

    Laurila, T., Vuorinen, V., Mattila, T. & Kivilahti, J. K., Jan 2005, In : Journal of Electronic Materials. 34, 1, p. 103-111 9 p.

    Research output: Contribution to journalArticle

  38. Published

    Failure Mechanisms of Lead-free Chip Scale Package Interconnections Under Fast Mechanical Loading

    Mattila, T. & Kivilahti, J., 2005, In : Journal of Electronic Materials. 34, 7, p. 969-976

    Research output: Contribution to journalArticle

  39. 2001
  40. Published

    Use of Multicomponent Phase Diagrams for Predicting Phase Evoution in Solder/Conductor Systems

    Zeng, K. & Kivilahti, J., 2001, In : Journal of Electronic Materials. 30, 1, p. 35-44

    Research output: Contribution to journalArticle

  41. 1998
  42. Published

    Thermodynamics of the Sn-In-Ag Solder System

    Korhonen, T. & Kivilahti, J. K., 1998, In : Journal of Electronic Materials. 27, 3, p. 149

    Research output: Contribution to journalArticle

  43. 1995
  44. Published

    Growth of high-quality GaSb by metalorganic vapor phase epitaxy.

    Sopanen, M., Koljonen, T., Lipsanen, H. & Tuomi, T., Nov 1995, In : Journal of Electronic Materials. 24, 11, p. 1691-1696 6 p.

    Research output: Contribution to journalArticle

  45. 1994
  46. Published

    Growth and Characterization of a GaAs/AlAs Superlattice with Variable Layer Thicknesses

    Lipsanen, H. K. & Airaksinen, V. M., May 1994, In : Journal of Electronic Materials. 23, 5, p. 465-470 6 p.

    Research output: Contribution to journalArticle

  47. 1991
  48. Published

    Direct, mass-analyzed ion-beam and arc-discharge deposition of diamondlike films

    Hirvonen, J. P., Koskinen, J., Lappalainen, R., Anttila, A. & Trkula, M., Feb 1991, In : Journal of Electronic Materials. 20, 2, p. 127-132 6 p.

    Research output: Contribution to journalArticle

ID: 297047