IEEE Transactions on Components, Packaging and Manufacturing Technology

Research outputs

  1. 2018
  2. Published

    Wafer-Level AuSn/Pt Solid-Liquid Interdiffusion Bonding

    Rautiainen, A., Vuorinen, V., Heikkinen, H. & Paulasto-Krockel, M., Feb 2018, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 2, p. 169-176

    Research output: Contribution to journalArticleScientificpeer-review

  3. 2006
  4. Published

    Nucleation Kinetics and Solidification Temperature of SnAgCu Interconnections During Reflow

    Yu, H. & Kivilahti, J. K., 2006, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 29, 4, p. 778-786

    Research output: Contribution to journalArticleScientificpeer-review

  5. Published

    Reliability of CSP Interconnections under Shock Loading Conditions

    Mattila, T. T., Marjamäki, P. & Kivilahti, J. K., 2006, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 29, 4, p. 787-795

    Research output: Contribution to journalArticleScientificpeer-review

  6. 1998
  7. Published

    A Fluxless Low Temperature Method for Electronics

    Kulojärvi, K. & Kivilahti, J. K., 1998, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 21, 2, p. 288

    Research output: Contribution to journalArticleScientificpeer-review

ID: 259025