ELECTRONIC MATERIALS LETTERS

Research outputs

  1. 2017
  2. Published

    Interfacial void segregation of Cl in Cu-Sn micro-connects

    Ross, G., Tao, X., Broas, M., Mäntyoja, N., Vuorinen, V., Graff, A., Altmann, F., Petzold, M. & Paulasto-Kröckel, M., 10 Jul 2017, In : ELECTRONIC MATERIALS LETTERS. 13, 4, p. 307-312 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

ID: 228097