Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications

Activity: Talk or presentation typesConference presentation

Glenn Ross - Speaker

Vesa Vuorinen - Contributor

Joseph Hotchkiss - Contributor

Jani Kaaos - Contributor

Mervi Paulasto-Kröckel - Contributor

This work demonstrates low temperature Cu-In-Sn SLID bonds for the application of low temperature wafer-level bonding. The results show microstructural and mechanical behaviour of micro-bumps fabricated at a range of low bonding temperatures.
3 Dec 2019

Event (Conference)

TitleInternational Conference on Wafer Bonding
Abbrev. TitleWaferBond
Period02/12/201904/12/2019
CityHalle
CountryGermany
Degree of recognitionInternational event

ID: 39235000