Low Temperature Wafer-Level Cu-In-Sn Solid-Liquid Interdiffusion (SLID) Bonding

Ross, G. (Invited speaker), Vuorinen, V. (Contributor), Paulasto-Kröckel, M. (Contributor)

Activity: Talk or presentation typesConference presentation

Period4 Oct 20209 Oct 2020
Event titlePRiME
Event typeConference
LocationHonolulu, United States, Hawaii