Low Temperature Wafer-Level Cu-In-Sn Solid Liquid Interdiffusion Bonding For Low Stress Applications

Activity: Talk or presentation types › Conference presentation

Description

This work demonstrates low temperature Cu-In-Sn SLID bonds for the application of low temperature wafer-level bonding. The results show microstructural and mechanical behaviour of micro-bumps fabricated at a range of low bonding temperatures.
Period3 Dec 2019
Event titleInternational Conference on Wafer Bonding
Event typeConference
LocationHalle, GermanyShow on map
Degree of RecognitionInternational

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