High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy

Sebastian Brand (Speaker), Michael Kögel (Contributor), Ross, G. (Contributor), Vuorinen, V. (Contributor), Paulasto-Kröckel, M. (Contributor), Matthias Petzold (Contributor)

Activity: Talk or presentation types › Conference presentation

Description

Solid-Liquid-Interdiffusion (SLID) bonding is promising for formation of:
-Bond frames and hermetic seals for MEMS
-Micro-connects for 3D integration in microelectronics
-Die attach for power semiconductors
Major advantages:
-Formation of high-temperature stable bonds processed at low temperatures
High strength
GHz-SAM allows defect detection down to few 100 nm diameter through a few µm of remnant Si
Application to bond quality analysis for process development studied with respect to small voids
Period27 Nov 2017 → 29 Nov 2017
Event titleConference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration
Event typeConference
LocationLeuven, Belgium
Degree of RecognitionInternational