High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy
- Sebastian Brand (Speaker)
- Michael Kögel (Contributor)
- Ross, G. (Contributor)
- Vuorinen, V. (Contributor)
- Paulasto-Kröckel, M. (Contributor)
- Matthias Petzold (Contributor)
Activity: Talk or presentation types › Conference presentation